ZHCSDE1B February   2015  – July 2016 CC2640

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  1-Mbps GFSK (Bluetooth low energy) - RX
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) - TX
    8. 5.8  2-Mbps GFSK (Bluetooth 5) - RX
    9. 5.9  2-Mbps GFSK (Bluetooth 5) - TX
    10. 5.10 5-Mbps (Proprietary) - RX
    11. 5.11 5-Mbps (Proprietary) - TX
    12. 5.12 24-MHz Crystal Oscillator (XOSC_HF)
    13. 5.13 32.768-kHz Crystal Oscillator (XOSC_LF)
    14. 5.14 48-MHz RC Oscillator (RCOSC_HF)
    15. 5.15 32-kHz RC Oscillator (RCOSC_LF)
    16. 5.16 ADC Characteristics
    17. 5.17 Temperature Sensor
    18. 5.18 Battery Monitor
    19. 5.19 Continuous Time Comparator
    20. 5.20 Low-Power Clocked Comparator
    21. 5.21 Programmable Current Source
    22. 5.22 Synchronous Serial Interface (SSI)
    23. 5.23 DC Characteristics
    24. 5.24 Thermal Resistance Characteristics
    25. 5.25 Timing Requirements
    26. 5.26 Switching Characteristics
    27. 5.27 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具与软件
    3. 8.3  文档支持
    4. 8.4  德州仪器 (TI) 低功耗射频网站
    5. 8.5  低功耗射频电子新闻简报
    6. 8.6  社区资源
    7. 8.7  其他信息
    8. 8.8  商标
    9. 8.9  静电放电警告
    10. 8.10 出口管制提示
    11. 8.11 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RHB|32
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Application, Implementation, and Layout

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

7.1 Application Information

Very few external components are required for the operation of the CC2640 device. This section provides some general information about the various configuration options when using the CC2640 in an application, and then shows two examples of application circuits with schematics and layout. This is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com.

Figure 7-1 shows the various RF front-end configuration options. The RF front end can be used in differential- or single-ended configurations with the options of having internal or external biasing. These options allow for various trade-offs between cost, board space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Reference designs exist for each of these options.

CC2640 CC26xx_Application_Circuit.gif Figure 7-1 CC2640 Application Circuit

Figure 7-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 8.3).

CC2640 CC26XX_Int_Ext_reg_may15.gif Figure 7-2 Supply Voltage Configurations

7.2 5 × 5 External Differential (5XD) Application Circuit

CC2640 circuit_1_external_differential_swrs178.gif Figure 7-3 5 × 5 External Differential (5XD) Application Circuit

7.2.1 Layout

CC2640 layout_5XD_swrs178.png Figure 7-4 5 × 5 External Differential (5XD) Layout

7.3 4 × 4 External Single-ended (4XS) Application Circuit

CC2640 circuit_2_external_single-ended_swrs178.gif Figure 7-5 4 × 4 External Single-ended (4XS) Application Circuit

7.3.1 Layout

CC2640 layout_app_circuit_02_4XS_v2.png Figure 7-6 4 × 4 External Single-ended (4XS) Layout