产品详情

Type Transceiver Protocols Bluetooth 4.0, Dual-mode Bluetooth Features Assisted A2DP/HFP 1.6, BR / EDR, Class 1 TX Power Operating temperature range (°C) -40 to 85 Rating Catalog
Type Transceiver Protocols Bluetooth 4.0, Dual-mode Bluetooth Features Assisted A2DP/HFP 1.6, BR / EDR, Class 1 TX Power Operating temperature range (°C) -40 to 85 Rating Catalog
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 CC256x Dual-Mode Bluetooth Controller 数据表 (Rev. E) PDF | HTML 2014年 3月 12日
应用手册 QFN 和 SON PCB 连接 (Rev. C) PDF | HTML 英语版 (Rev.C) PDF | HTML 2024年 1月 5日
选择指南 CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022年 5月 13日
应用手册 DN035 -- Antenna Quick Guide (Rev. B) 2022年 2月 9日
应用简报 低功耗蓝牙、基本速率/增强型数据速率–方法混淆配对漏洞 英语版 PDF | HTML 2021年 7月 19日
网络安全公告文章 Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
白皮书 Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017年 10月 16日
白皮书 Which TI Bluetooth® solution should I choose? 2017年 5月 5日
白皮书 White Paper: Why Classic Bluetooth® (BR/EDR)? 2017年 5月 4日
应用手册 CC256XQFN PCB Guidelines (Rev. B) 2016年 10月 28日
用户指南 CC256x Hardware Design Checklist (Rev. A) 2016年 10月 28日
更多文献资料 Dual-mode Bluetooth CC256x solutions (Rev. C) 2016年 2月 3日
用户指南 Dual-Mode Bluetooth CC2564 Evaluation Board User Guide 2015年 12月 28日
用户指南 Dual-Mode Bluetooth CC2564 Evaluation Board Quick Start Guide 2015年 10月 1日
技术文章 Three reasons why our dual-mode Bluetooth stack is your new go-to software solutio PDF | HTML 2015年 8月 17日
用户指南 CC256x QFN EM User Guide Wiki 2015年 6月 16日
更多文献资料 物联网的发展过程 英语版 2014年 9月 3日
白皮书 Three Flavors of Bluetooth: Which One to Choose? 2014年 3月 25日
更多文献资料 TI: The IoT technology leader 2013年 11月 1日
应用手册 AN058 -- Antenna Selection Guide (Rev. B) 2010年 10月 6日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

BOOST-CC2564MODA — TMP107 BoosterPack 模块

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

用户指南: PDF
TI.com 上无现货
评估板

CC2564MODAEM — CC2564 具有集成天线的双模蓝牙模块评估板

CC2564MODAEM 评估板包含蓝牙 BR/EDR/LE HCI 解决方案。bCC2564MODA 基于 TI 的 CC2564B 双模蓝牙单芯片器件,旨在用于评估和设计,能够减少设计工作量,实现产品快速上市。


为了实现完整的评估,CC2564MODAEM 板直接插入 TI 硬件开发套件,包括 MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C123G 和 DK-TM4C129X。此外,MSP430 和 TM4C12x MCU 还可以使用通过认证且免专利费的 TI 蓝牙协议栈 (TIBLUETOOTHSTACK-SDK)。


CC2564MODA (...)

用户指南: PDF | HTML
TI.com 上无现货
评估板

CC2564MODNEM — CC2564 Bluetooth® 双路模式模块评估版

CC2564MODNEM 评估板包含 CC2564MODN 器件,且专用于评估和设计。

为提供完整的评估解决方案,CC2564MODNEM 板可直接插入我们的硬件开发套件:MSP-EXP430F5529MSP-EXP430F5438DK-TM4C129X 和适用于其他 MCU 的套件。TI 的 Bluetooth® 协议栈已经过认证且免专利费,适用于 MSP430™ MCU (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW)。

提供的 CC2564MODNEM 硬件设计文件(原理图、布局和 (...)

用户指南: PDF
TI.com 上无现货
评估板

CC256XQFNEM — 双模 Bluetooth® CC2564 评估板

CC256XQFNEM 评估板包含 CC2564B 器件,用于 CC256x 器件的评估和设计。

为实现完整的评估解决方案,CC256XQFNEM 评估板可直接插入 TI 硬件开发套件中:MSP-EXP430F5529MSP-EXP430F5438DK-TM4C129X 和其他 MCU。此外,MSP430 (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW) 还可以使用经过认证且免专利费的 TI 蓝牙协议栈。

CC256XQFNEM 硬件设计文件(原理图、布局和 BOM)作为参考提供,以帮助实施 (...)

用户指南: PDF
TI.com 上无现货
评估板

EK-TM4C129EXL — TM4C129E Cypto Connected LaunchPad

注意:EK-TM4C129EXL 当前促销价截至 10 月 5 日。立即下单吧!

Crypto Connected LaunchPad 搭载了经过硬件加密且具备加速器功能的 MCU,使您能够开发高性能、数据受保护的互联式物联网应用,涵盖从安全云连接、楼宇/工厂自动化和智能电网到工业控制等多种应用。

TM4C129E Crypto Connected LaunchPad 评估套件是基于 ARM® Cortex-M4 的微控制器的低成本评估平台。此套件的重点在于 TM4C129ENCPDT MCU 及片上加密加速硬件、10/100 以太网 MAC 和 PHY、USB (...)

用户指南: PDF
TI.com 上无现货
接口适配器

CC256XSTBTBLESW — 基于 STM32F4 MCU 的 TI 双模 Bluetooth® 协议栈

TI 出品的适用于蓝牙 + 蓝牙低功耗的 STM32F4 MCU 软件上的双模蓝牙堆栈可实现 STM32 ARM Cortex M4,且由用于实施蓝牙 4.0 规范的单模和双模产品所构成。该蓝牙堆栈已完全通过认证(QDID 37180 或 QDID 69887 以及 QDID 42849 或 QDID 69886),可提供简易命令行采样应用以加速开发,并可按需提供 MFI 功能。

为实现完整的评估解决方案,CC256XSTBTBLESW 可直接与硬件开发套件 STM3240G-EVAL 搭配使用。此外,适用于 STM32 MCU 的堆栈已通过认证且免专利费 (CC256XSTBTBLESW)。

(...)

用户指南: PDF | HTML
软件开发套件 (SDK)

TIBLUETOOTHSTACK-SDK — 基于 Stonestreet One Bluetopia 的 TI 蓝牙堆栈

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

用户指南: PDF | HTML
驱动程序或库

CC256XM4BTBLESW — 基于 TM4C MCU 的 TI 双模 Bluetooth® 协议栈

TI 出品的适用于蓝牙 + 蓝牙低功耗的 TM4C MCU 软件上的双模蓝牙堆栈可实现 TM4C12x MCU,且由用于实现蓝牙 4.0 规范的单模和双模产品所构成。该蓝牙堆栈已完全通过认证(QDID 37180 和 QDID 42849),同时还可提供简易命令行采样应用以加速开发,并可按需提供 MFI 功能。

CC256XM4BTBLESW 直接与 TI 硬件开发套件 DK-TM4C123G 和 DK-TM4C129X 配合工作。此外,适用于 TM4C12x MCU 的堆栈已通过认证且免专利费。

该软件可与所有 CC256x EM 板(CC256XQFNEM 和 (...)

用户指南: PDF
驱动程序或库

CC256XMS432BTBLESW — 基于 MSP432 MCU 的 TI 双模蓝牙协议栈

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
用户指南: PDF
驱动程序或库

CC256XMSPBTBLESW — 用于 MSP430 上的 CC256x 的 Stonestreet One BT+BLE 堆栈和配置文件

基于 MSP430™ MCU 软件的 TI 双模蓝牙堆栈(适用于蓝牙 + 蓝牙低功耗)可支持 MSP430 MCU,且同时包含实施蓝牙 4.0 规范的单模和双模产品。该蓝牙堆栈已完全通过认证(QDID 37180 和 QDID 42849),同时还可提供简易命令行示例应用以加速开发,并可按需提供 MFI 功能。

为实现完整的评估解决方案,CC256XMSPBTBLESW 可直接与 TI 硬件开发套件 MSP-EXP430F5529 和 MSP-EXP430F5438 搭配使用。此外,适用于 MSP430 MCU 的堆栈已通过认证且免专利费。

该软件可与所有 CC256x EM (...)

用户指南: PDF
IDE、配置、编译器或调试器

CCSTUDIO Code Composer Studio 集成式开发环境 (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

支持的产品和硬件

支持的产品和硬件

此设计资源支持这些类别中的大部分产品。

查看产品详情页,验证是否能提供支持。

启动 下载选项
计算工具

SWRC256 — CC256x 蓝牙硬件评估工具

The CC256x Bluetooth Hardware Evaluation Tool is a Texas Instruments (TI) tool which can be downloaded as a complete package from the TI web site. It is a very intuitive, user-friendly tool to evaluate TI's Bluetooth chips. More specifically, it is used to configure the BT chip's properties (...)
设计工具

DUALMODE-BT-DESIGN-REVIEWS — CC256x 设备的硬件设计评审

开始 WiLink 硬件设计审查流程:
  • 第 1 步:申请审查前,需查看相应产品页面上的技术文档及设计与开发资源(请参阅下面 CC256x 产品页面的链接)。
  • 第 2 步:填写申请表,开始审查流程。TI 专家将通过您提供的电子邮件地址直接与您联系,为您提供后续步骤。

在双模 BT 硬件设计审查流程中,您可与主题专家一对一沟通,专家会帮您审查设计并提供重要反馈。申请审查前,需查看相应产品页面上的技术文档及设计与开发资源。了解产品页面上的资源后,您可能无需申请设计审查。< /p>

申请审查双模 BT 硬件设计前,应在我们的 E2E 论坛上提交一般设计问题。

审查过程中,我们会联系您提供以下信息:

  • (...)
用户指南: PDF
参考设计

BT-MSPAUDSINK-RD — 蓝牙 和 MSP430 音频信宿参考设计

TI 的蓝牙 + MSP430 音频散热器参考设计可供客户用于创建各种低端、低功耗音频解决方案的应用。一些可能的应用 - 玩具、低端蓝牙扬声器、音频播放配件。此参考设计是一种经济实惠的音频实施方案,通过参考其提供的完整设计文件,您可以将重心转移到应用和最终产品开发工作上。此参考设计支持的软件包括 Stonestreet One Bluetopia 蓝牙堆栈(经过认证且免专利费)。
用户指南: PDF
原理图: PDF
参考设计

CC256XEM-RD — CC256x Bluetooth® 参考设计

该 CC256x Bluetooth® 评估模块参考设计是一款射频参考设计,带有可轻松连接至多种微控制器单元 (MCU) 的天线(例如,TI 的 MSP430 或 Tiva C 系列 MCU)。该参考设计可复制到电路板中,从而使设计具有成本效益并加快推向市场。该蓝牙设计受到可订购评估模块、免版税软件和文档、测试和认证提示以及社区支持资源的支持。有关更多信息,请访问我们的 Wiki。
用户指南: PDF
原理图: PDF
参考设计

TIDA-00598 — 用于 CC256X 蓝牙控制器的低噪声、小外形电源管理参考设计

TIDA-00598 具有一个低噪音且尺寸经过优化的功率管理解决方案,能将 5 V 电压调节为操作 CC256X 蓝牙控制器所需的 3.3 V 和 1.8 V 电压。这些经过调节的电压轨也可用于为系统中的其他组件(例如微控制器、电平位移器和传感器)供电。
设计指南: PDF
原理图: PDF
参考设计

BT-MSPAUDSOURCE-RD — 蓝牙和 MSP430 音频源参考设计

您可将蓝牙和 MSP430 音频源参考设计用于创建适用于低端、低功耗音频解决方案(包括玩具、投影仪、智能遥控器和各种音频播放配件)的各种应用。此参考设计是一种经济实惠的音频实施方案,具有完整的设计文件,让您可以专注于应用和最终产品的开发。此参考设计同样提供 TI Bluetooth Stack。
用户指南: PDF
原理图: PDF
封装 引脚 下载
VQFNP-MR (RVM) 76 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频