ZHCSCR2 July   2014

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 说明（续）
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics: Supply Current
    6. 8.6  Electrical Characteristics: I/O
    7. 8.7  Electrical Characteristics: ADC
    8. 8.8  Electrical Characteristics: Power-On Reset
    9. 8.9  Electrical Characteristics: Oscillator
    10. 8.10 Electrical Characteristics: Data Flash Memory
    11. 8.11 Electrical Characteristics: Register Backup
    12. 8.12 SMBus Timing Specifications
    13. 8.13 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Primary (1st Level) Safety Features
      2. 9.3.2 Secondary (2nd Level) Safety Features
      3. 9.3.3 Charge Control Features
      4. 9.3.4 Fuel Gauging
      5. 9.3.5 Lifetime Data Logging
      6. 9.3.6 Authentication
      7. 9.3.7 Battery Parameter Measurements
        1. 9.3.7.1 Current and Coulomb Counting
        2. 9.3.7.2 Voltage
        3. 9.3.7.3 Temperature
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 Physical Interface
      2. 9.5.2 SMBus Address
      3. 9.5.3 SMBus On and Off State
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Schematic
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Measurement System
          1. 10.2.3.1.1 Cell Voltages
          2. 10.2.3.1.2 External Average Cell Voltage
          3. 10.2.3.1.3 Current
          4. 10.2.3.1.4 Temperature
        2. 10.2.3.2 Gas Gauging
        3. 10.2.3.3 Charging
          1. 10.2.3.3.1 Fast Charging Voltage
          2. 10.2.3.3.2 Fast Charging Current
          3. 10.2.3.3.3 Other Charging Modes
        4. 10.2.3.4 Protection
        5. 10.2.3.5 Peripheral Features
          1. 10.2.3.5.1 LED Display
          2. 10.2.3.5.2 SMBus Address
      4. 10.2.4 Application Performance Plots
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Power Supply Decoupling Capacitor
      2. 12.1.2 MRST Connection
      3. 12.1.3 Communication Line Protection Components
      4. 12.1.4 ESD Spark Gap
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 相关文档　
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 相关文档　

相关文档如下：

  • 《bq78350 技术参考》手册 (SLUUAN7)
  • 《使用 bq78350》应用手册 (SLUA726)
  • 《bq769x0 用于锂离子和磷酸盐应用的 3 节到 15 节电池监控器系列》数据手册 (SLUSBK2)

13.2 商标

All other trademarks are the property of their respective owners.

13.3 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

13.4 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。