ZHCSF53A April   2016  – June 2016

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  MP-A5 Coil Specification
      2. 8.3.2  High Voltage Dedicated Charging Port (HVDCP) Negotiation
      3. 8.3.3  Fast Charge Support
      4. 8.3.4  Option Select Pins
      5. 8.3.5  FOD and Parasitic Metal Object Detect (PMOD) Calibration
      6. 8.3.6  FOD Ping Calibration
      7. 8.3.7  Shut Down Through External Thermal Sensor or Trigger
      8. 8.3.8  Fault Handling and Indication
      9. 8.3.9  Power Transfer Start Signal
      10. 8.3.10 Power-On Reset
      11. 8.3.11 External Reset, RESET Pin
      12. 8.3.12 Trickle Charge and CS100
    4. 8.4 Device Functional Modes
      1. 8.4.1 LED Modes
      2. 8.4.2 Power Transfer
      3. 8.4.3 Communication
      4. 8.4.4 Power Trains
      5. 8.4.5 Power Train Voltage Control
      6. 8.4.6 Signal Processing Components
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Capacitor Selection
        2. 9.2.2.2 Current Monitoring Requirements
        3. 9.2.2.3 All Unused Pins
        4. 9.2.2.4 Input Regulators
        5. 9.2.2.5 Input Power Requirements
        6. 9.2.2.6 LED Mode
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature (unless otherwise noted)
MIN MAX UNIT
Voltage applied at V33D to DGND –0.3 3.8 V
Voltage applied at V33A to AGND –0.3 3.8
Voltage applied to any pin(2) –0.3 3.8
Storage temperature, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.

7.2 ESD Ratings

MAX UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 V
TA Operating free-air temperature range –40 85 °C
TJ Junction temperature 125

7.4 Thermal Information

THERMAL METRIC(1) bq501210 UNIT
RGC (VQFN)
64 Pins
RθJA Junction-to-ambient thermal resistance 29.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.1 °C/W
RθJB Junction-to-board thermal resistance 8.4 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 8.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IV33A Supply current V33A = 3.3 V 8 15 mA
IV33D V33D = 3.3 V 44 55
ITotal V33D = V33A = 3.3 V 52 70
EXTERNALLY SUPPLIED 3.3 V POWER
V33D Digital 3.3-V power TA = 25°C 3 3.6 V
V33A Analog 3.3-V power TA = 25°C 3 3.6
V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 and 2.9 V,
V33A = V33D		 0.25 V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A–, COMM_B+, COMM_B–, COMM_C+, COMM_C–
VCM Common mode voltage each pin –0.15 1.631 V
COMM+, COMM– Modulation voltage digital resolution 1 mV
REA Input Impedance Ground reference 0.5 1.5 3 MΩ
IOFFSET Input offset current 1-kΩ source impedance –5 5 µA
ANALOG INPUTS: V_SENSE, I_SENSE, T_SENSE, LED_MODE, CAL_INPUT, V_IN
VADC_OPEN Voltage indicating open pin LED_MODE, CAL_INPUT open 2.37 V
VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, CAL_INPUT shorted to ground 0.36
VADC_RANGE Measurement range for voltage monitoring All analog inputs 0 2.5
INL ADC integral nonlinearity –2.5 2.5 mV
Ilkg Input leakage current 3 V applied to pin 100 nA
RIN Input impedance Ground reference 8 MΩ
CIN Input capacitance 10 pF
DIGITAL INPUTS/OUTPUTS
VOL Low-level output voltage IOL = 6 mA , V33D = 3 V DGND1 + 0.25 V
VOH High-level output voltage IOH = –6 mA , V33D = 3 V V33D – 0.6 V
VIH High-level input voltage V33D = 3 V 2.1 3.6
VIL Low-level input voltage V33D = 3.5 V 1.4
IOH(MAX) Output high-source current 4 mA
IOL(MAX) Output low-sink current 4
SYSTEM PERFORMANCE
VRESET Voltage where device comes out of reset V33D pin 2.4 V
tRESET Pulse duration needed for reset RESET pin 2 µs
ƒSW Switching frequency (wireless power transfer) System input power at startup > 6 V 130 kHz
< 6 V 110
< 6 V, HVDCP to 9 or 12 V 130
tdetect Time to detect presence of device requesting power 0.5 s
Write_Cycles Number of nonvolatile erase/write cycles TJ = 25°C 20 k cycles
PWM RAIL
ƒSW_RAIL Switching frequency 4 * ƒSW kHz

7.6 Typical Characteristics

bq501210 PWM-AB.gif
CH2 = PWM-A (1 V / Division)
CH3 = PWM-B (1 V / Division)
Figure 1. Typical PWM-A and PWM-B Signals
bq501210 TXcoilRXout-5W.gif
CH2 = RX communication signal (5 V / Division)
CH3 = TX coil voltage (10 V / Division)
Figure 3. TX Coil and RX Communication Signals
With RX 5-W Load
bq501210 TXcoilRXout-0W.gif
CH2 = RX communication signal (5 V / Division)
CH3 = TX coil voltage (10 V / Division)
Figure 2. TX Coil and RX Communication Signals
With RX No Load
bq501210 TXcoilRXout-15W.gif
CH2 = RX communication signal (5 V / Division)
CH3 = TX coil voltage (20 V / Division)
Figure 4. TX Coil and RX Communication Signals
With RX 15-W Load