ZHCSDZ3D December   2014  – January 2017

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Voltage
    6. 7.6  Supply Current
    7. 7.7  Power Supply Control
    8. 7.8  Low-Voltage General Purpose I/O (TSx)
    9. 7.9  High-Voltage General Purpose I/O (GPIO0, GPIO1)
    10. 7.10 AFE Power-On Reset
    11. 7.11 Internal 1.8-V LDO
    12. 7.12 Current Wake Comparator
    13. 7.13 Coulomb Counter
    14. 7.14 CC Digital Filter
    15. 7.15 ADC
    16. 7.16 ADC Digital Filter
    17. 7.17 ADC Multiplexer
    18. 7.18 Cell Balancing Support
    19. 7.19 Cell Detach Detection
    20. 7.20 Internal Temperature Sensor
    21. 7.21 NTC Thermistor Measurement Support (ADCx)
    22. 7.22 High-Frequency Oscillator
    23. 7.23 Low-Frequency Oscillator
    24. 7.24 Voltage Reference 1
    25. 7.25 Voltage Reference 2
    26. 7.26 Instruction Flash
    27. 7.27 Data Flash
    28. 7.28 Current Protection Thresholds
    29. 7.29 N-CH FET Drive (CHG, DSG)
    30. 7.30 FUSE Drive (AFEFUSE)
    31. 7.31 Battery Charger Voltage Regulation (VFB)
    32. 7.32 Battery Charger Current Sense (HSRP, HSRN)
    33. 7.33 Battery Charger Precharge Current Sense (HSRP, HSRN)
    34. 7.34 AC Adapter Fault Detect (HSRN, VCC)
    35. 7.35 Battery Charger Overcurrent Detection (V)HSRP, (V)HSRN
    36. 7.36 Battery Charger Undercurrent Detection (V)HSRP, (V)HSRN
    37. 7.37 System Operation Detection (V)HSRN
    38. 7.38 Battery Overvoltage Comparator (VFB)
    39. 7.39 Regulator (REGN)
    40. 7.40 PWM High-Side Driver (HiDRV)
    41. 7.41 PWM Low-Side Driver (LoDRV)
    42. 7.42 PWM Information
    43. 7.43 Charger Power-Up Sequence
    44. 7.44 Thermal Shutdown Comparator
    45. 7.45 SMBus High Voltage I/O
    46. 7.46 SMBus
    47. 7.47 SMBus XL
    48. 7.48 Timing Requirements
    49. 7.49 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Safety Features
      2. 8.3.2  Analog Front End (AFE) Details
        1. 8.3.2.1 Wake Up Comparator
        2. 8.3.2.2 Cell Balancing Support
        3. 8.3.2.3 FET Drive
        4. 8.3.2.4 Fuse Drive
      3. 8.3.3  Charge Controller Details
        1. 8.3.3.1 Precharge Modes
        2. 8.3.3.2 Zero-Volt Charge Support
        3. 8.3.3.3 Charge Termination
      4. 8.3.4  Fuel Gauge and Control Details
        1. 8.3.4.1 Battery Trip Point (BTP)
        2. 8.3.4.2 Lifetime Data Logging Features
      5. 8.3.5  Authentication
      6. 8.3.6  LED Display
      7. 8.3.7  Internal Temperature Sensor
      8. 8.3.8  External Temperature Sensor Support
      9. 8.3.9  High Frequency Oscillator
      10. 8.3.10 Communications
        1. 8.3.10.1 SMBus On and Off State
        2. 8.3.10.2 SBS Commands
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
        4. 9.2.2.4 Power MOSFETs Selection
        5. 9.2.2.5 Input Filter Design
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 相关文档　

如需相关文档，请参阅《bq40z60 技术参考手册》（文献编号：SLUUA04）。

12.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 商标

Impedance Track, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.