ZHCSDX9E September   2014  – January 2017 AMC1304L05 , AMC1304L25 , AMC1304M05 , AMC1304M25

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: AMC1304x05
    10. 7.10 Electrical Characteristics: AMC1304x25
    11. 7.11 Switching Characteristics
    12. 7.12 Insulation Characteristics Curves
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Modulator
      3. 8.3.3 Digital Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Output
      2. 8.4.2 Output Behavior in Case of a Full-Scale Input
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Digital Filter Usage
    2. 9.2 Typical Applications
      1. 9.2.1 Frequency Inverter Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Isolated Voltage Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Do's and Don'ts
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

A layout recommendation showing the critical placement of the decoupling capacitors (as close as possible to the AMC1304) and placement of the other components required by the device is shown in Figure 59. For best performance, place the shunt resistor close to the VINP and VINN inputs of the AMC1304 and keep the layout of both connections symmetrical.

For the AMC1304Lx version, place the 100-Ω termination resistor as close as possible to the CLKIN, CLKIN_N inputs of the device to achieve highest signal integrity. If not integrated, an additional termination resistor is required as close as possible to the LVDS data inputs of the MCU or filter device; see Figure 60.

11.2 Layout Examples

AMC1304L05 AMC1304L25 AMC1304M05 AMC1304M25 ai_cmos_bas655.gif Figure 59. Recommended Layout of the AMC1304Mx
AMC1304L05 AMC1304L25 AMC1304M05 AMC1304M25 ai_lvds_bas655.gif Figure 60. Recommended Layout of the AMC1304Lx