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Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family AC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family AC Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35
  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-um Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Thin Shrink Small-Outline (DGG) Package, 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings

    EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-um Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Thin Shrink Small-Outline (DGG) Package, 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings

    EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AC16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements

These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction control (DIR) input. The output-enable input (OE\) can be used to disable the devices so that the buses are effectively isolated.

The 74AC16245 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16245 is characterized for operation from -40°C to 85°C.

The 'AC16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements

These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction control (DIR) input. The output-enable input (OE\) can be used to disable the devices so that the buses are effectively isolated.

The 74AC16245 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16245 is characterized for operation from -40°C to 85°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 16-Bit Bus Transceivers With 3-State Outputs 数据表 (Rev. A) 1996年 4月 1日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
更多文献资料 HiRel Unitrode Power Management Brochure 2009年 7月 7日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日
应用手册 Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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SSOP (DL) 48 查看选项

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  • REACH
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  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 封装厂地点

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