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TMUX4053 ACTIVE +/-12-V, 2:1, 3-channel multiplexer with 1.8-V logic compatible logic Lower current leakage

Product details

Configuration 2:1 SPDT Number of channels 3 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 23 CON (typ) (pF) 5.6 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 50 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 2:1 SPDT Number of channels 3 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 23 CON (typ) (pF) 5.6 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 50 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 SSOP (DB) 16 48.36 mm² 6.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4 TVSOP (DGV) 16 23.04 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • 1.65V to 5.5V VCC operation
  • Support mixed-mode voltage operation on all ports
  • High on-off output-voltage ratio
  • Low crosstalk between switches
  • Individual switch controls
  • Extremely low input current
  • Latch-up performance exceeds 250mA per JESD 17
  • ESD protection exceeds JESD 22
    • 2000V Human-Body Model (A114-A)
    • 1000V Charged-Device Model (C101)
  • 1.65V to 5.5V VCC operation
  • Support mixed-mode voltage operation on all ports
  • High on-off output-voltage ratio
  • Low crosstalk between switches
  • Individual switch controls
  • Extremely low input current
  • Latch-up performance exceeds 250mA per JESD 17
  • ESD protection exceeds JESD 22
    • 2000V Human-Body Model (A114-A)
    • 1000V Charged-Device Model (C101)

These triple 2-channel CMOS analog multiplexers/demultiplexers are designed for 1.65V to 5.5V VCC operation.

The SNx4LV4053A devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

These triple 2-channel CMOS analog multiplexers/demultiplexers are designed for 1.65V to 5.5V VCC operation.

The SNx4LV4053A devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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Type Title Date
* Data sheet SNx4LV4053A Triple 2-Channel Analog Multiplexers or Demultiplexers datasheet (Rev. L) PDF | HTML 05 Jun 2024
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 Apr 2024
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Technical article Achieving highly accurate full-scale charge and discharge current control for high PDF | HTML 13 Aug 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

SN74LV4053A IBIS Model

SCLM115.ZIP (10 KB) - IBIS Model
Reference designs

PMP15038 — 50A, 0.05% Current Accuracy Power Reference Design for Battery Test Systems

This reference design introduces a large current, highly accurate and bi-directional power solution used in battery test systems (BTS). It includes a LM5170EVM-BIDIR and a signal control board. The LM5170EVM-BIDIR is an evaluation board  to showcase the high performance of the dual-channel (...)
Test report: PDF
Schematic: PDF
Reference designs

PMP15043 — 6A, 0.05% Current Accuracy Power Solution for Battery Test Systems Reference Design

This reference design circuit introduces a highly accurate, bi-directional current power solution used in battery test systems (BTS). The maximum current capability is 6A with lower than 0.05% full scale accuracy. Controlling through a logic pin, the circuit can be used to charge or discharge a (...)
Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
SSOP (DB) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
TVSOP (DGV) 16 Ultra Librarian
VQFN (RGY) 16 Ultra Librarian

Ordering & quality

Information included:
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  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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