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描述

This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC).  This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and (...)

主要特色

  • AM57x processor with Dual ARM Cortex-A15, C66x DSP, ARM Cortex-M4, SGX544 graphics, and quad core PRU-ICSS feature set
  • TPS659037 companion PMIC
  • Design reference for PMIC, PDN, and Thermal
  • Power Estimation Tool (PET) for estimating system power and Power consumption summary
  • This reference design is (...)

Applications Matched

  • 通信设备

描述

TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy (...)

主要特色

  • The TIDEP0046 TI reference design uses OpenCL that does not require the user to be a DSP expert.
  • It provides an example of Monte-Carlo algorithm to generate Gaussian random sequences which runs faster on the C66x DSP than on the ARM Cortex-A15 core.
  • It is a complete system reference design with (...)

Applications Matched

  • 通信设备

描述

这项经过验证的设计可准确测量承载 -48V 的总线上的电流、电压和功率,且能够利用 I²C 兼容接口提供相应数据。此设计适用于电信应用,因为最常见的电信设备均由此负电源电压供电。它使用 INA226 和 ISO1541。INA226 是具有 I²C 兼容接口的电流分流器/功率监控器。该器件将精确地处理这些测量数据,并使用 ISO1541 将负电压转换为接地基准信号。ISO1541 是低功耗双向 I²C 兼容隔离器。

主要特色

  • 可报告承载 -48V 的总线上的电流、电压和功率
  • 高精度:

- 10µV 偏移(最大值)

- 0.1% 增益误差(最大值)

  • I²C 兼容接口
  • 支持隔离的板对板通信
  • I²C 兼容隔离器可将 -48V 基准转换为接地基准信号

 

Applications Matched

  • 通信设备

描述

High speed multi-channel applications require precise clocking solutions capable of managing channel-to-channel skew in order to achieve optimal system SNR, SFDR, and ENOB. This reference design is capable of supporting two high speed channels on separate boards by utilizing TI’s LMX2594 (...)

主要特色

  • Up to 15GHz sample clock generation
  • Multi-channel JESD204B compliant clock solution
  • Low phase noise clocking for RF sampling ADC/DAC
  • Configurable phase synchronization to achieve low skew in multi-channel system
  • Supports TI’s high-speed converter and capture cards (ADC12DJ3200EVM, TSW14J56 / TSW14J57)

Applications Matched

  • 通信设备

描述

This reference design focuses on providing a compact, high-performance, multiphase solution suitable for powering Intel® Stratix® 10 GX field-programmable gate arrays (FPGAs) with a specific focus on the SG2800-I1V variant. Integrated PMBus™ allows for easy output voltage setting and (...)

主要特色

  • 4-phase power supply 0.9V/140A Stratix 10 GX
  • PMBus programming of Vout, and Voltage Margining for Arria Smart VID, 10mV per step
  • PMBus monitoring of Input/Output Voltage, Current, Power, and Temperature
  • 90% efficiency at 12VIN, 0.9V/60A

Applications Matched

  • 通信设备

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
隔离/非隔离
隔离/非隔离
输入类型
输入类型
拓扑
拓扑
Designed for
Designed for
PMP20176.1
(Output
Voltage1)
10.8 13.2 .9 140 126 Non-Isolated DC Buck- Multiphase
Buck- Synchronous

描述

这种简单的小型低噪声反向电源模块设计(电压逆变器)在 3V 至 11.5V 的输入电压以及高达 1.5A 的电流下明确支持 –5V 输出电压。该设计采用 TI 具有反向降压/升压拓扑的 TPS82130 MicroSiP™ 电源模块降压转换器,可实现 (...)

主要特色

  • 简单电源模块设计
  • 总体解决方案尺寸小于 50mm2
  • 1.5A 的高输出电流(输入电压不低于 7.5V)
  • 3V 至 11.5V 宽输入电压范围
  • 低噪声(小于 10mV 输出纹波)
  • 额定 125°C 解决方案

Applications Matched

  • 通信设备

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
隔离/非隔离
隔离/非隔离
输入类型
输入类型
拓扑
拓扑
Designed for
Designed for
TIDA-01457.1
(Output
Voltage1)
3 11.5 -5 1.5 7.5 Non-Isolated DC Buck Boost- Inverting

描述

此小型简单的反向电源参考设计采用具有反向降压/升压拓扑的高精度降压转换器。它可在 3V 至 4.5V 的输入电压以及 400mA 的电流条件下生成 -12V 输出,从而在空间有限的应用(如面向电信基础设施的光学网络系统、面向无线基础设施的有源分布式天线系统或远程射频单元,以及工业领域的测试和测量应用)中实现干净的电源负电压轨。

主要特色

  • -12V 高负输出电压
  • 总体解决方案尺寸小于 65mm2
  • 400mA 的高输出电流
  • 低输出电压波纹 (<0.5%)
  • 输入电压范围为 3V 至 4.5V
  • 额定 125°C 解决方案

Applications Matched

  • 通信设备

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
隔离/非隔离
隔离/非隔离
输入类型
输入类型
拓扑
拓扑
Designed for
Designed for
TIDA-01423.1
(Output
Voltage1)
3 4.5 -12 .4 4.8 Non-Isolated DC Buck Boost- Inverting

描述

A 4 phase buck regulator design fully complaint to power the core rail of Intel Arria 10 GX FPGAs, specifically the 10AX115U145IVG  variant. Integrated PMBus allows for easy output voltage setting and telemetry of key design parameters. The design enables programming, configuration, Smart VID (...)

主要特色

  • 4-phase power supply 0.9V/150A Arria 10 GX (10AX115U145IVG)
  • PMBus programming of Vout, and Voltage Margining for Arria Smart VID, 10mV per step
  • PMBus monitoring of Input/Output Voltage, Current, Power, and Temperature
  • 90% efficiency at 12VIN, 0.9V/100A

Applications Matched

  • 通信设备

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
隔离/非隔离
隔离/非隔离
输入类型
输入类型
拓扑
拓扑
Designed for
Designed for
TIDA-01419.1
(Output
Voltage1)
10.8 13.2 .9 150 135 Non-Isolated DC Buck- Multiphase
Buck- Synchronous

描述

TIDA-01367 uses the TPS53679 multiphase controller and CSD95490Q5MC Smart Power Stages to implement a high-performance design suitable for powering networking application-specific integrated circuits (ASICs).

The dual outputs of the controller target a 240-A, 0.8-V core rail with a six-phase design (...)

主要特色

  • Dual Rail 6+1 Design - High-Powered Core Rail and Single Phase Auxilliary Rail
  • PMBus programming of Vout, and Voltage Margining for Arria Smart VID, 10mV per step
  • PMBus monitoring of Input/Output Voltage, Current, Power, and Temperature
  • Peal Efficiencies of 90 and 91% for Core and Aux Rails

Applications Matched

  • 通信设备

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
隔离/非隔离
隔离/非隔离
输入类型
输入类型
拓扑
拓扑
Designed for
Designed for
TIDA-01367.1
(Output
Voltage1)
10.8 13.2 .9 150 135 Non-Isolated DC Buck- Multiphase
Buck- Synchronous

描述

This reference design demonstrates how to interface an MSP430 MCU featuring CapTIvate™ technology with an MSP432 MCU host microcontroller using the CapTIvate Software Library communications module. The design integrates capacitive touch technology with haptics, an MSP432 MCU as host, driving a (...)

主要特色

  • Ultra-low-power MSP430 microcontroller featuring CapTIvate touch technology and FRAM
  • Mutual capacitance HMI with 17 buttons, 2 sliders, 1 wheel, a proximity/guard channel and haptics
  • MSP432 MCU, a low-power, high-performance 32-bit ARM® Cortex®-M4F host 
  • 320 x 240 pixel SPI controlled TFT QVGA display  
  • (...)

Applications Matched

  • 通信设备

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