SCLS418H June   1998  – December 2014 SN74AHCT367

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Noise Characteristics
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DB|16
  • PW|16
  • D|16
  • DGV|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 Features

  • Inputs are TTL-Voltage Compatible
  • True Outputs
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 200-V Machine Model
    • 2000-V Charged-Device Model

2 Applications

  • Telecom Infrastructure
  • TVs
  • Set Top Boxes
  • Network Switches
  • Wireless Infrastructure
  • Electronic Points of Sale

3 Description

The SN74AHCT367 device is designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74AHCT367 PDIP (16) 19.30 mm x 6.35 mm
SSOP (16) 6.50 mm x 5.30 mm
TSSOP (16) 5.00 mm x 4.40 mm
SOP (16) 10.20 mm x 5.30 mm
SOIC (16) 9.00 mm x 3.90 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Simplified Schematic

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