ZHCSID1B June   2018  – April 2021 LSF0204-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.8 V)
    7. 6.7  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.2 V)
    8. 6.8  Switching Characteristics: AC Performance (Translating Up, 1.8 V to 3.3 V)
    9. 6.9  Switching Characteristics: AC Performance (Translating Up, 1.2 V to 1.8 V)
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Auto-Bidirectional Voltage Translation Without DIR Pin Terminal
      2. 7.3.2 Support Multiple High Speed Translation Interfaces
      3. 7.3.3 5-V Tolerance on IO Port and 125°C Support
      4. 7.3.4 Channel Specific Translation
      5. 7.3.5 Ioff, Partial Power Down Mode
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 I2C, PMBus, SMBus, GPIO Application
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Bidirectional Translation
            1. 8.2.1.2.1.1 Pull-Up Resistor Sizing
        3. 8.2.1.3 Application Curve
      2. 8.2.2 MDIO Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Multiple Voltage Translation in Single Device, Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 符合面向汽车应用的 AEC-Q100 标准
    • 温度等级 1:–40°C ≤ TA ≤ 125°C
    • 器件 HBM ESD 分类等级 2
    • CDM ESD 分类等级 C6
  • 可在无方向引脚的情况下提供自动双向电压转换
  • 支持开漏或推挽应用,如 I2C、I2S、SPI、UART、JTAG、MDIO、SDIO 和 GPIO
  • 在电容负载不超过 30pF 的情况下,支持最高 100MHz 的上行转换和大于 100MHz 的下行转换,
    在 50pF 电容负载下支持最高 40MHz 的上行/下行转换
  • 支持 Ioff 局部断电模式(请参阅 Section 7.3
  • 可实现以下电压之间的双向电压电平转换
    • 0.95V ↔ 1.8、2.5、3.3、5.5V
    • 1.2V ↔ 1.8、2.5、3.3、5.5V
    • 1.8V ↔ 2.5、3.3、5.5V
    • 2.5V ↔ 3.3、5.5V
    • 3.3V ↔ 5.5V
  • I/O 端口可耐受 5V 电压
  • 低 Ron 可实现更佳的信号完整性
  • 采用直通引脚排列来简化 PCB 布线
  • 闩锁性能超过 100mA,符合 JESD17 规范