ZHCSA67F June   2012  – April 2021 DRV8837 , DRV8838

PRODUCTION DATA  

  1. 特性
  2. 应用范围
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2. 5.1 Dapper Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bridge Control
      2. 7.3.2 Independent Half-Bridge Control
      3. 7.3.3 Sleep Mode
      4. 7.3.4 Power Supplies and Input Pins
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 VCC Undervoltage Lockout
        2. 7.3.5.2 Overcurrent Protection (OCP)
        3. 7.3.5.3 Thermal Shutdown (TSD)
        4. 7.3.5.4 28
    4. 7.4 Device Functional Modes
      1.      Application and Implementation
        1. 8.1 Application Information
        2. 8.2 Typical Application
          1. 8.2.1 Design Requirements
          2. 8.2.2 Detailed Design Procedure
            1. 8.2.2.1 Motor Voltage
            2. 8.2.2.2 Low-Power Operation
          3. 8.2.3 Application Curves
  8. Power Supply Recommendations
    1. 8.1 Bulk Capacitance
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Power Dissipation
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
      1.      Mechanical, Packaging, and Orderable Information

特性

  • H 桥电机驱动器
    • 驱动直流电机或其他负载
    • 低 MOSFET 导通电阻:HS + LS 280mΩ
  • 1.8A 最大驱动电流
  • 独立的电机和逻辑电源引脚:
    • 电机 VM:0 至 11 V
    • 逻辑 VCC:1.8 至 7 V
  • PWM 或 PH-EN 接口
    • DRV8837: PWM、IN1 和 IN2
    • DRV8838:PH 和 EN
  • 低功耗休眠模式,休眠电流最大值仅为 120nA
    • nSLEEP 引脚
  • 小型封装尺寸
    • 带有散热焊盘的 8 引脚 WSON 封装
    • 2.0mm × 2.0mm
  • 保护特性
    • VCC 欠压闭锁 (UVLO)
    • 过流保护 (OCP)
    • 热关断 (TSD)