SNLS044D May   2000  – July 2016 DS90LV047A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LVDS Fail-Safe
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Probing LVDS Transmission Lines
        2. 9.2.2.2 Data Rate vs Cable Length Graph Test Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Decoupling Recommendations
      2. 11.1.2 Differential Traces
      3. 11.1.3 Termination
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

See (1)
MIN MAX UNIT
Supply voltage (VCC) −0.3 4 V
Input voltage (DIN) −0.3 VCC + 0.3 V
Enable input voltage (EN, EN*) −0.3 VCC + 0.3 V
Output voltage (DOUT+, DOUT–) −0.3 3.9 V
Short-circuit duration (DOUT+, DOUT–) Continuous
Maximum package power dissipation at +25°C D0016A package 1088 mW
PW0016A package 866
Derate D0016A package above +25°C 8.5 mW/°C
Derate PW0016A package above +25°C 6.9
Lead temperature Soldering (4 s) 260 °C
Maximum junction temperature 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±10000 V
Machine Model ±1200
(1) ESD Ratings:
    HBM (1.5 kΩ, 100 pF)     
    EIAJ (0 Ω, 200 pF)

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Supply voltage, VCC 3 3.3 3.6 V
Operating free air temperature, TA −40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1) DS90LV047A UNIT
PW (TSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 114 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51 °C/W
RθJB Junction-to-board thermal resistance 59 °C/W
ψJT Junction-to-top characterization parameter 8 °C/W
ψJB Junction-to-board characterization parameter 58 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Over supply voltage and operating temperature ranges, unless otherwise specified(1)(2)(3)
PARAMETER TEST CONDITIONS PIN MIN TYP MAX UNIT
VOD1 Differential output voltage RL = 100 Ω (Figure 17) DOUT−
DOUT+
250 310 450 mV
ΔVOD1 Change in magnitude of VOD1 for complementary output states 1 35 |mV|
VOS Offset voltage 1.125 1.17 1.375 V
ΔVOS Change in magnitude of VOS for complementary output states 1 25 |mV|
VOH Output high voltage 1.33 1.6 V
VOL Output low voltage 0.9 1.02 V
VIH Input high voltage DIN, EN, EN* 2 VCC V
VIL Input low voltage GND 0.8 V
IIH Input high current VIN = VCC or 2.5 V −10 2 +10 µA
IIL Input low current VIN = GND or 0.4 V −10 −2 +10 µA
VCL Input clamp voltage ICL = −18 mA −1.5 −0.8 V
IOS Output short-circuit current(4) ENABLED,
DIN = VCC, DOUT+ = 0 V or
DIN = GND, DOUT− = 0 V
DOUT−
DOUT+
−4.2 −9 mA
IOSD Differential output short-circuit current(4) ENABLED, VOD = 0 V −4.2 −9 mA
IOFF Power-off leakage VOUT = 0 V or 3.6 V, VCC = 0 V or Open −20 ±1 20 µA
IOZ Output TRI-STATE current EN = 0.8 V and EN* = 2.0 V
VOUT = 0 V or VCC
−10 ±1 10 µA
ICC No load supply current drivers enabled DIN = VCC or GND VCC 4 8 mA
ICCL Loaded supply current drivers enabled RL = 100 Ω all channels, DIN = VCC or GND (all inputs) 20 30 mA
ICCZ No load supply current drivers disabled DIN = VCC or GND, EN = GND,
EN* = VCC
2.2 6 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: VOD1 and ΔVOD1.
(2) All typicals are given for: VCC = 3.3 V, TA = +25°C.
(3) The DS90LV047A is a current mode device and only functions within datasheet specifications when a resistive load is applied to the driver outputs typical range is (90 Ω to 110 Ω).
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.

6.6 Switching Characteristics

VCC = +3.3V ± 10%, TA = −40°C to +85°C(1)(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPHLD Differential propagation delay high to low RL = 100 Ω, CL = 15 pF
(Figure 18 and Figure 19)
0.5 0.9 1.7 ns
tPLHD Differential propagation delay low to high 0.5 1.2 1.7 ns
tSKD1 Differential pulse skew |tPHLD − tPLHD|(4) 0 0.3 0.4 ns
tSKD2 Channel-to-channel skew(5) 0 0.4 0.5 ns
tSKD3 Differential part-to-part skew(6) 0 1 ns
tSKD4 Differential part-to-part skew(7) 0 1.2 ns
tTLH Rise time 0.5 1.5 ns
tTHL Fall time 0.5 1.5 ns
tPHZ Disable time high to Z RL = 100 Ω, CL = 15 pF
(Figure 20 and Figure 21)
2 5 ns
tPLZ Disable time low to Z 2 5 ns
tPZH Enable time Z to high 3 7 ns
tPZL Enable time Z to low 3 7 ns
fMAX Maximum operating frequency(8) 200 250 MHz
(1) All typicals are given for: VCC = 3.3 V, TA = +25°C.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50 Ω, tr ≤ 1 ns, and tf ≤ 1 ns.
(3) CL includes probe and jig capacitance.
(4) tSKD1 |tPHLD – tPLHD| is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel.
(5) tSKD2 is the differential channel-to-channel skew of any event on the same device.
(6) tSKD3, differential part-to-part skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
(7) tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay.
(8) fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0 V to 3 V. Output criteria: duty cycle = 45% / 55%,
VOD > 250 mV, all channels switching.

6.7 Typical Characteristics

DS90LV047A 10088714.png Figure 1. Output High Voltage vs Power Supply Voltage
DS90LV047A 10088716.png Figure 3. Output Short Circuit Current vs
Power Supply Voltage
DS90LV047A 10088718.png Figure 5. Differential Output Voltage vs
Power Supply Voltage
DS90LV047A 10088720.png Figure 7. Offset Voltage vs Power Supply Voltage
DS90LV047A 10088723.png Figure 9. Power Supply Current vs Ambient Temperature
DS90LV047A 10088725.png Figure 11. Differential Propagation Delay vs
Ambient Temperature
DS90LV047A 10088727.png Figure 13. Differential Skew vs Ambient Temperature
DS90LV047A 10088729.png Figure 15. Transition Time vs Ambient Temperature
DS90LV047A 10088715.png Figure 2. Output Low Voltage vs Power Supply Voltage
DS90LV047A 10088717.png Figure 4. Output TRI-STATE Current vs
Power Supply Voltage
DS90LV047A 10088719.png Figure 6. Differential Output Voltage vs Load Resistor
DS90LV047A 10088722.png Figure 8. Power Supply Current vs Power Supply Voltage
DS90LV047A 10088724.png Figure 10. Differential Propagation Delay vs
Power Supply Voltage
DS90LV047A 10088726.png Figure 12. Differential Skew vs Power Supply Voltage
DS90LV047A 10088728.png Figure 14. Transition Time vs Power Supply Voltage
DS90LV047A 10088730.png Figure 16. Data Rate vs Cable Length