ZHCSGM9A August   2017  – September 2017 TUSB214

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化的原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EQ
      2. 7.3.2 DC BOOST
      3. 7.3.3 BC1.2 CDP Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) Mode
      2. 7.4.2 Full Speed (FS) Mode
      3. 7.4.3 High Speed (HS) Mode
      4. 7.4.4 Shutdown Mode
      5. 7.4.5 I2C Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.1 Design Requirements

For this design example, use parameters shown in the table below.

Table 3. Design Parameters

PARAMETERVALUE
VCC (3.0V to 3.6V) 3.3 V
I2C support required in system (Yes/No) No
AC Boost REQ Level AC Boost Level 2:
REQ = 3.83 K
0 Ω 0
1.69 k ±1% 1
3.83 k ±1% 2
DNI 3
DC Boost RDC1 RDC2 Level Mid DC Level:
RDC1 = DNI
RDC2 = DNI
22 kΩ - 47 kΩ Do Not Install (DNI) 40 mV Low DC Boost
DNI DNI 60 mV Mid DC Boost
DNI 22 kΩ - 47 kΩ 80 mV High DC Boost