ZHCS235D December   2011  – April 2015 TPS7A33

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Enable Pin Operation
      3. 7.3.3 Programmable Soft-Start
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Adjustable Operation
      2. 8.1.2  Capacitor Recommendations
      3. 8.1.3  Input and Output Capacitor Requirements
      4. 8.1.4  Noise Reduction and Feed-Forward Capacitor Requirements
      5. 8.1.5  Post DC-DC Converter Filtering
      6. 8.1.6  Audio Applications
      7. 8.1.7  Maximum AC Performance
      8. 8.1.8  Power-Supply Rejection
      9. 8.1.9  Output Noise
      10. 8.1.10 Transient Response
      11. 8.1.11 Power for Precision Analog
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don’ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Thermal Performance and Heat Sink Selection
    4. 10.4 Package Mounting
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (February 2013) to D Revision

  • Added ESD 额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • 已更正数据表标题以显示精确的最大输出电流；将“–1A”更改为“1A”Go
  • Changed 首页图并已删除声明 RGW 封装处于产品预览状态的注释Go
  • Changed Pin Configuration and Functions section; updated table format and deleted footnote about RGW product-preview statusGo
  • Deleted footnote from Pin Functions table indicating RGW product-preview statusGo
  • Deleted footnote (2) from Absolute Maximum Ratings tableGo
  • Deleted note from Thermal Information table stating that RGW package was product preview Go
  • Corrected condition values for Figure 23Go
  • Corrected condition values for Figure 24Go
  • Corrected condition values and trace indicators for Figure 25Go
  • Corrected condition values and trace indicators for Figure 26Go
  • Changed CSS value from 1 µF to 10 nF in Figure 27Go
  • Deleted Parametric Measurement Information section Go
  • Revised Functional Block DiagramGo
  • Changed first paragraph of Adjustable Operation section stating the device output voltage rangeGo
  • Changed Equation 2 for clarity Go
  • Changed last sentence of Capacitor Recommendations section Go
  • Changed noise reduction capacitor value from 1 µF to 10 nF in first paragraph of Power-Supply Rejection section.Go
  • Revised last paragraph of Power-Supply Rejection sectionGo
  • Changed noise reduction capacitor value from 1 µF to 10 nF in second paragraph of Output Noise section.Go
  • Added footnote (1) to Figure 32Go
  • Changed title for Figure 41Go
  • Changed title for Figure 42Go
  • Changed Power Dissipation section title to Layout Guidelines for Thermal Performance and Heat Sink SelectionGo
  • Revised wording in Layout Guidelines for Thermal Performance section for clarification Go

Changes from B Revision (March 2012) to C Revision

  • Changed 产品状态，从混合状态更改为量产数据Go
  • Added 最后一段至说明部分Go
  • Changed 典型应用方框图Go
  • Updated Figure 31Go

Changes from A Revision (December 2011) to B Revision

  • Changed 产品状态，从量产数据更改为混合状态Go
  • Added RGW 引脚图Go
  • Added RGW pinout drawing to Pin Configuration and Functions sectionGo
  • Added RGW and footnote 1 to Pin Functions tableGo
  • Added RGW column to Thermal Information tableGo

Changes from * Revision (December 2011) to A Revision

  • Changed 产品状态，从产品预览更改为量产数据Go