ZHCSHU2B March   2018  – October 2018 TPS7A10

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      压降与 IOUT 和温度间的关系(YKA 封装)
      2.      典型应用电路
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Global Undervoltage Lockout (UVLO)
      3. 7.3.3 Active Discharge
      4. 7.3.4 Enable
      5. 7.3.5 Sequencing Requirement
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Behavior During Transition From Dropout Into Regulation
      6. 8.1.6 Undervoltage Lockout Circuit Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DSE|6
  • YKA|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

DSE Package
6-Pin WSON
Top View
YKA Package
5-Pin DSBGA
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME DSE YKA
IN 6 A1 I Input pin. For best transient response and to minimize input impedance, use the recommended or larger value ceramic capacitor from IN to ground. as listed in the Recommended Operation Conditions. Place the input capacitor as close as possible to input of the device.
OUT 1 A3 O Regulated output pin. A capacitor is required from OUT to ground for stability. For best transient response, use larger than the minimum recommended value ceramic capacitor. Follow the recommended capacitor value as listed in the Recommended Operation Conditions. Place the output capacitor as close as possible to output of the device.
GND 5 B2 Ground pin. This pin must be connected to ground.
BIAS 4 C1 I BIAS pin. This pin enables the use of low-input voltage, low-output voltage conditions, (LILO). For best response, use the recommended or larger value ceramic capacitor from BIAS to ground as listed in the Recommended Operation Conditions. Place the bias capacitor as close as possible to input of the device.
EN 3 C3 I Enable pin. Driving this pin to logic high enables the device. Driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN or BIAS; however, connecting EN to IN is only acceptable if the VIN voltage is greater than 0.9 V.