4 Revision History
Changes from T Revision (August 2010) to U Revision
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Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement Go
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Changed "free-air temperature" to "junction temperature" in Recommended Operating Conditions condition statement Go
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Changed Thermal Information table; updated thermal resistance values for all packages Go
Changes from S Revision (August, 2009) to T Revision
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Replaced Dissipation Ratings Table with Thermal Information TableGo
Changes from R Revision (May, 2008) to S Revision
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Changed Figure 10Go
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Added paragraph about recommended start-up sequence to Internal Current Limit sectionGo
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Added paragraph about current foldback and device start-up to Enable Pin and Shutdown sectionGo