ZHCSFD9B July   2016  – October 2018 TPS61230A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
      2.      效率
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Startup
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Under-Voltage Lockout (UVLO)
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Over Voltage Protection
      6. 7.3.6 Load Disconnect
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 PFM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS61230A 2.5-V to 4.5-V Input, 5-V Output Converter
        1. 8.2.1.1 TPS61230A 5-V Output Design Requirements
        2. 8.2.1.2 TPS61230A 5-V Detailed Design Procedure
          1. 8.2.1.2.1 Programming The Output Voltage
          2. 8.2.1.2.2 Inductor and Capacitor Selection
            1. 8.2.1.2.2.1 Inductor Selection
            2. 8.2.1.2.2.2 Output Capacitor Selection
            3. 8.2.1.2.2.3 Input Capacitor Selection
          3. 8.2.1.2.3 Loop Stability, Feed Forward Capacitor
        3. 8.2.1.3 TPS61230A 5-V Output Application Performance Plots
      2. 8.2.2 Systems Example - TPS61230A with Feed Forward Capacitor for Best Transient Response
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Layout Guidelines

For all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at the GND pin of the IC. The most critical current path for all boost converters is from the switching FET, through the synchronous FET, then the output capacitors, and back to ground of the switching FET. Therefore, the output capacitors and their traces should be placed on the same board layer as the IC and as close as possible between the IC’s VOUT and GND pin.

See Figure 26 for the recommended layout.