ZHCSAX0C February   2013  – July 2016 TPS2546

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics: High-Bandwidth Switch
    7. 6.7 Electrical Characteristics: Charging Controller
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Standard Downstream Port (SDP) USB 2.0/USB 3.0
      2. 8.3.2  Charging Downstream Port (CDP)
      3. 8.3.3  Dedicated Charging Port (DCP)
        1. 8.3.3.1 DCP BC1.2 and YD/T 1591-2009
        2. 8.3.3.2 DCP Divider Charging Scheme
        3. 8.3.3.3 DCP 1.2-V Charging Scheme
      4. 8.3.4  Wake on USB Feature (Mouse/Keyboard Wake Feature)
        1. 8.3.4.1 USB 2.0 Background Information
        2. 8.3.4.2 Wake On USB
        3. 8.3.4.3 USB Slow-Speed and Full-Speed Device Recognition
          1. 8.3.4.3.1 No CTL Pin Timing Requirement After Wake Event and Transition from S3 to S0
      5. 8.3.5  Load Detect
      6. 8.3.6  Power Wake
        1. 8.3.6.1 Implementing Power Wake in Notebook System
      7. 8.3.7  Port Power Management (PPM)
        1. 8.3.7.1 Benefits of PPM
        2. 8.3.7.2 PPM Details
        3. 8.3.7.3 Implementing PPM in a System with Two Charging Ports
      8. 8.3.8  Overcurrent Protection
      9. 8.3.9  FAULT Response
      10. 8.3.10 Undervoltage Lockout (UVLO)
      11. 8.3.11 Thermal Sense
    4. 8.4 Device Functional Modes
      1. 8.4.1 DCP Auto Mode
      2. 8.4.2 DCP Forced Shorted / DCP Forced Divider1
      3. 8.4.3 High-Bandwidth Data Line Switch
      4. 8.4.4 Device Truth Table (TT)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Discharge
      2. 9.1.2 CDP/SDP Auto Switch
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current-Limit Settings
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档 
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (January 2016) to C Revision

Changes from A Revision (Febuary 2013) to B Revision

  • 已添加 ESD 额定值表,特性 描述部分,器件功能模式应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分。Go

Changes from * Revision (February 2013) to A Revision

  • 已将器件状态从“产品预览”改为“量产数据”Go