SLOS704B January   2011  – August 2015 TPA6138A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Direct Path Headphone Driver
    4. 9.4 Device Functional Modes
      1. 9.4.1 Mute Operation
      2. 9.4.2 Using the TPA6138A2 as a Second-Order Filter
      3. 9.4.3 TPA6138A2 UVP Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Gain-Setting Resistor Ranges
      2. 10.1.2 Input-Blocking Capacitors
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Charge-Pump Flying Capacitor and VSS Capacitor
        2. 10.2.2.2 Decoupling Capacitors
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Gain-Setting Resistors
      2. 12.1.2 Decoupling Capacitors Placement
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

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11 Power Supply Recommendations

The TPA6138A2 DirectPath headphone amplifier requires adequate power supply decoupling to ensure that output noise and total harmonic distortion (THD) remain low. Use good low equivalent-series-resistance (ESR) ceramic capacitors (X5R material or better is required for best performance). Place a 2.2 μF capacitor within 5 mm of the VDD pin. Reducing the distance between the decoupling capacitor and VDD minimizes parasitic inductance and resistance, improving TPA6138A2 supply rejection performance. Use 0402 or smaller size capacitors if possible.

For additional supply rejection, connect an additional 10 μF or higher value capacitor between VDD and ground. This will help filter lower frequency power supply noise. The high power supply rejection ratio (PSRR) of the TPA6138A2 makes the 10μF capacitor unnecessary in most applications.