ZHCS986B May   2012  – December 2018 TLV320DAC3203

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 描述
    1.     Device Images
      1.      简化方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, Bypass Outputs
    6. 6.6  Electrical Characteristics, Microphone Interface
    7. 6.7  Electrical Characteristics, Audio Outputs
    8. 6.8  Electrical Characteristics, LDO
    9. 6.9  Electrical Characteristics, Misc.
    10. 6.10 Electrical Characteristics, Logic Levels
    11. 6.11 Typical Timing Characteristics — Audio Data Serial Interface Timing (I2S)
    12. 6.12 Typical DSP Timing Characteristics
    13. 6.13 I2C Interface Timing
    14. 6.14 SPI Interface Timing (See )
    15. 6.15 Typical Characteristics
      1. 6.15.1 Typical Characteristics, FFT
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Connections
        1. 7.3.1.1 Digital Pins
          1. 7.3.1.1.1 Multifunction Pins
        2. 7.3.1.2 Analog Pins
      2. 7.3.2 Analog Audio I/O
        1. 7.3.2.1 Analog Low Power Bypass
        2. 7.3.2.2 Headphone Outputs
      3. 7.3.3 Digital Microphone Inteface
        1. 7.3.3.1 ADC Processing Blocks — Overview
          1. 7.3.3.1.1 Processing Blocks
      4. 7.3.4 DAC
        1. 7.3.4.1 DAC Processing Blocks — Overview
      5. 7.3.5 Powertune
      6. 7.3.6 Digital Audio I/O Interface
      7. 7.3.7 Clock Generation and PLL
      8. 7.3.8 Control Interfaces
        1. 7.3.8.1 I2C Control
        2. 7.3.8.2 SPI Control
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
LDOIN(2) Power Supply Voltage Range Referenced to AVss(1) 1.9 3.6 V
AVdd 1.5 1.8 1.95
IOVDD Referenced to IOVSS(1) 1.1 3.6
DVdd Referenced to DVss(1) 1.65 1.8 1.95
DVdd(3) 1.26 1.8 1.95
PLL Input Frequency Clock divider uses fractional divide
(D > 0), P=1, DVdd ≥ 1.65V (See table in SLAU434, Maximum TLV320DAC3203 Clock Frequencies)		 10 20 MHz
Clock divider uses integer divide
(D = 0), P=1, DVdd ≥ 1.65V (Refer to table in SLAU434, Maximum TLV320DAC3203 Clock Frequencies)		 0.512 20 MHz
MCLK Master Clock Frequency MCLK; Master Clock Frequency; DVdd ≥ 1.65V 50 MHz
SCL SCL Clock Frequency 400 kHz
HPL, HPR Stereo headphone output load resistance Single-ended configuration 14.4 16 Ω
Headphone output load resistance Differential configuration 24.4 32 Ω
CLout Digital output load capacitance 10 pF
Cref Reference decoupling capacitor 1 µF
(1) All grounds on board are tied together, so they should not differ in voltage by more than 0.2V max, for any combination of ground signals.
(2) Minimum spec applies if LDO is used. Minimum is 1.5V if LDO is not enabled. Using the LDO below 1.9V degrades LDO performance.
(3) At DVdd values lower than 1.65V, the PLL does not function. Please see table in SLAU434, Maximum TLV320DAC3203 Clock Frequencies for details on maximum clock frequencies.