SLAS663C August   2009  – June 2016 TLV320AIC3106-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Switching Characteristics I2S/LJF/RJF In Master Mode
    7. 8.7  Switching Characteristics I2S/LJF/RJF In Slave Mode
    8. 8.8  Switching Characteristics DSP In Master Mode
    9. 8.9  Switching Characteristics DSP In Slave Mode
    10. 8.10 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Audio Data Converters
      2. 9.3.2  Stereo Audio ADC
        1. 9.3.2.1 Stereo Audio ADC High-Pass Filter
      3. 9.3.3  Automatic Gain Control (AGC)
      4. 9.3.4  Stereo Audio DAC
      5. 9.3.5  Digital Audio Processing For Playback
      6. 9.3.6  Digital Interpolation Filter
      7. 9.3.7  Delta-Sigma Audio Dac
      8. 9.3.8  Audio Dac Digital Volume Control
      9. 9.3.9  Analog Output Common-Mode Adjustment
      10. 9.3.10 Audio DAC Power Control
      11. 9.3.11 Audio Analog Inputs
      12. 9.3.12 Analog Input Bypass Path Functionality
      13. 9.3.13 ADC PGA Signal Bypass Path Functionality
      14. 9.3.14 Input Impedance and VCM Control
      15. 9.3.15 MICBIAS Generation
      16. 9.3.16 Analog Fully Differential Line Output Drivers
      17. 9.3.17 Analog High Power Output Drivers
      18. 9.3.18 Short Circuit Output Protection
      19. 9.3.19 Jack and Headset Detection
      20. 9.3.20 General-Purpose I/O
    4. 9.4 Device Functional Modes
      1. 9.4.1 Digital Audio Processing For Record Path
      2. 9.4.2 Increasing DAC Dynamic Range
      3. 9.4.3 Passive Analog Bypass During Powerdown
      4. 9.4.4 Digital Microphone Connectivity
    5. 9.5 Programming
      1. 9.5.1  Hardware Reset
      2. 9.5.2  Digital Control Serial Interface
        1. 9.5.2.1 SPI Control Mode
        2. 9.5.2.2 SPI Communication Protocol
          1. 9.5.2.2.1 Limitation On Register Writing
        3. 9.5.2.3 Continuous Read and Write Operation
      3. 9.5.3  I2C Control Mode
      4. 9.5.4  I2C Bus Debug In A Glitched System
      5. 9.5.5  Digital Audio Data Serial Interface
      6. 9.5.6  Right-Justified Mode
      7. 9.5.7  Left-Justified Mode
      8. 9.5.8  I2S Mode
      9. 9.5.9  DSP Mode
      10. 9.5.10 TDM Data Transfer
      11. 9.5.11 Audio Clock Generation
    6. 9.6 Register Maps
      1. 9.6.1 Output Stage Volume Controls
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, And Orderable Information

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1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 3: –40°C to 85°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 1C
    • Device CDM ESD Classification Level C6
  • Stereo Audio DAC
    • 102-dBA Signal-to-Noise Ratio
    • 16-, 20-, 24-, or 32-Bit Data
    • Supports Rates From 8 kHz to 96 kHz
    • 3D, Bass, Treble, EQ, De-Emphasis Effects
    • Flexible Power Saving Modes and Performance are Available
  • Stereo Audio ADC
    • 92-dBA Signal-to-Noise Ratio
    • Supports Rates From 8 kHz to 96 kHz
    • Digital Signal Processing and Noise Filtering Available During Record
  • Ten Audio Input Pins
    • Programmable in Single-Ended or Fully Differential Configurations
    • 3-State Capability for Floating Input Configurations
  • Seven Audio Output Drivers
    • Stereo Fully Differential or Single-Ended Headphone Drivers
    • Fully Differential Stereo Line Outputs
    • Fully Differential Mono Output
  • Low Power: 15-mW Stereo 48-kHz Playback With 3.3-V Analog Supply
  • Ultralow-Power Mode with Passive Analog Bypass
  • Programmable I/O Analog Gains
  • Programmable PLL for Flexible Clock Generation
  • Control Bus Selectable SPI or I2C
  • Audio Serial Data Bus Supports I2S, Left/Right-Justified, DSP, and TDM Modes
  • Power Supplies:
    • Analog: 2.7 V to 3.6 V
    • Digital Core: 1.65 V to 1.95 V
    • Digital I/O: 1.1 V to 3.6 V

2 Applications

  • Cluster
  • Head Unit
  • Car Audio
  • Emergency Call (eCall)
  • Telematics Control Unit

3 Description

The TLV320AIC3106-Q1 is a low-power stereo audio codec with stereo headphone amplifier, as well as multiple inputs and outputs programmable in single-ended or fully differential configurations. Extensive register-based power control is included, enabling stereo 48-kHz DAC playback as low as 15 mW from a 3.3-V analog supply, making it ideal for car audio applications in cluster and head unit systems.

The record path of the TLV320AIC3106-Q1 contains integrated microphone bias, digitally controlled stereo microphone preamplifier, and automatic gain control (AGC), with mix and mux capability among the multiple analog inputs. Programmable filters are available during record which can remove audible noise that can occur in unpredictable environments, such as when an eCall system is activated. The playback path includes mix and mux capability from the stereo DAC and selected inputs, through programmable volume controls, to the various outputs.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV320AIC3106-Q1 VQFN (48) 7.00 mm × 7.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Diagram

TLV320AIC3106-Q1 SimplifiedDiagram_slas509.png

4 Revision History

Changes from B Revision (October 2012) to C Revision

  • Added Applications section, Device Information table, Device Comparison Table, Table of Contents, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Timing Requirements table, Switching Characteristics table, Timing and Switching Diagrams, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information Table; see POA at the end of the datasheetGo
  • Changed R to R/W for Bit D0 for Page 0, Registers 79, 86, and 93Go

Changes from A Revision (January 2010) to B Revision

  • Changed TA in Electrical Characteristics condition from 25°C to –40°C to 85°C.Go
  • Added 25°C to the THD Test Conditions in Electrical Characteristics table.Go
  • Added 25°C to the DAC DIGITAL INTERPOLATION title in Electrical Characteristics table.Go
  • Added 25°C to the DIGITAL I/O title in Electrical Characteristics table.Go