SLOS081M February 1977 – December 2021 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC (1) | TL082H | UNIT | |||
---|---|---|---|---|---|
D (SOIC) |
DDF (SOT-23) |
PW (TSSOP) |
|||
8 PINS | 8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 147.8 | 181.5 | 200.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 88.2 | 112.5 | 89.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 91.4 | 98.2 | 131.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 36.8 | 17.2 | 22.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 90.6 | 97.6 | 129.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |