ZHCSI92C May   2018  – December 2018 TAS5805M

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     简化方框图
      1.      Device Images
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
      1. 7.7.1 Bridge Tied Load (BTL) Configuration Curves with 1SPW Mode
      2. 7.7.2 Bridge Tied Load (BTL) Configuration Curves with BD Mode
      3. 7.7.3 Bridge Tied Load (BTL) Configuration Curves with Ferrite Bead + Capacitor as the Output Filter
      4. 7.7.4 Parallel Bridge Tied Load (PBTL) Configuration with 1SPW Modulation
      5. 7.7.5 Parallel Bridge Tied Load (PBTL) Configuration with BD Modulation
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power Supplies
      2. 9.3.2 Device Clocking
      3. 9.3.3 Serial Audio Port – Clock Rates
      4. 9.3.4 Clock Halt Auto-recovery
      5. 9.3.5 Sample Rate on the Fly Change
      6. 9.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 9.3.7 Digital Audio Processing
      8. 9.3.8 Class D Audio Amplifier
        1. 9.3.8.1 Speaker Amplifier Gain Select
    4. 9.4 Device Functional Modes
      1. 9.4.1 Software Control
      2. 9.4.2 Speaker Amplifier Operating Modes
        1. 9.4.2.1 BTL Mode
        2. 9.4.2.2 PBTL Mode
      3. 9.4.3 Low EMI Modes
        1. 9.4.3.1 Spread Spectrum
        2. 9.4.3.2 Channel to Channel Phase Shift
        3. 9.4.3.3 Multi-Devices PWM Phase Synchronization
      4. 9.4.4 Thermal Foldback
      5. 9.4.5 Device State Control
      6. 9.4.6 Device Modulation
        1. 9.4.6.1 BD Modulation
        2. 9.4.6.2 1SPW Modulation
        3. 9.4.6.3 Hybrid Modulation
    5. 9.5 Programming and Control
      1. 9.5.1 I2 C Serial Communication Bus
      2. 9.5.2 Slave Address
        1. 9.5.2.1 Random Write
        2. 9.5.2.2 Sequential Write
        3. 9.5.2.3 Random Read
        4. 9.5.2.4 Sequential Read
        5. 9.5.2.5 DSP Memory Book, Page and BQ Coefficients Update
        6. 9.5.2.6 Example Use
        7. 9.5.2.7 Checksum
          1. 9.5.2.7.1 Cyclic Redundancy Check (CRC) Checksum
          2. 9.5.2.7.2 Exclusive or (XOR) Checksum
      3. 9.5.3 Control via Software
        1. 9.5.3.1 Startup Procedures
        2. 9.5.3.2 Shutdown Procedures
        3. 9.5.3.3 Protection and Monitoring
          1. 9.5.3.3.1 Overcurrent Shutdown (OCSD)
          2. 9.5.3.3.2 DC Detect
    6. 9.6 Register Maps
      1. 9.6.1 CONTROL PORT Registers
        1. 9.6.1.1  RESET_CTRL Register (Offset = 1h) [reset = 0x00]
          1. Table 7. RESET_CTRL Register Field Descriptions
        2. 9.6.1.2  DEVICE_CTRL_1 Register (Offset = 2h) [reset = 0x00]
          1. Table 8. DEVICE_CTRL_1 Register Field Descriptions
        3. 9.6.1.3  DEVICE_CTRL_2 Register (Offset = 3h) [reset = 0x10]
          1. Table 9. DEVICE_CTRL_2 Register Field Descriptions
        4. 9.6.1.4  I2C_PAGE_AUTO_INC Register (Offset = Fh) [reset = 0x00]
          1. Table 10. I2C_PAGE_AUTO_INC Register Field Descriptions
        5. 9.6.1.5  SIG_CH_CTRL Register (Offset = 28h) [reset = 0x00]
          1. Table 11. SIG_CH_CTRL Register Field Descriptions
        6. 9.6.1.6  CLOCK_DET_CTRL Register (Offset = 29h) [reset = 0x00]
          1. Table 12. CLOCK_DET_CTRL Register Field Descriptions
        7. 9.6.1.7  SDOUT_SEL Register (Offset = 30h) [reset = 0h]
          1. Table 13. SDOUT_SEL Register Field Descriptions
        8. 9.6.1.8  I2S_CTRL Register (Offset = 31h) [reset = 0x00]
          1. Table 14. I2S_CTRL Register Field Descriptions
        9. 9.6.1.9  SAP_CTRL1 Register (Offset = 33h) [reset = 0x02]
          1. Table 15. SAP_CTRL1 Register Field Descriptions
        10. 9.6.1.10 SAP_CTRL2 Register (Offset = 34h) [reset = 0x00]
          1. Table 16. SAP_CTRL2 Register Field Descriptions
        11. 9.6.1.11 SAP_CTRL3 Register (Offset = 35h) [reset = 0x11]
          1. Table 17. SAP_CTRL3 Register Field Descriptions
        12. 9.6.1.12 FS_MON Register (Offset = 37h) [reset = 0x00]
          1. Table 18. FS_MON Register Field Descriptions
        13. 9.6.1.13 BCK_MON Register (Offset = 38h) [reset = 0x00]
          1. Table 19. BCK_MON Register Field Descriptions
        14. 9.6.1.14 CLKDET_STATUS Register (Offset = 39h) [reset = 0x00]
          1. Table 20. CLKDET_STATUS Register Field Descriptions
        15. 9.6.1.15 DIG_VOL_CTL Register (Offset = 4Ch) [reset = 30h]
          1. Table 21. DIG_VOL_CTR Register Field Descriptions
        16. 9.6.1.16 DIG_VOL_CTRL2 Register (Offset = 4Eh) [reset = 0x33]
          1. Table 22. DIG_VOL_CTRL2 Register Field Descriptions
        17. 9.6.1.17 DIG_VOL_CTRL3 Register (Offset = 4Fh) [reset = 0x30]
          1. Table 23. DIG_VOL_CTRL3 Register Field Descriptions
        18. 9.6.1.18 AUTO_MUTE_CTRL Register (Offset = 50h) [reset = 0x07]
          1. Table 24. AUTO_MUTE_CTRL Register Field Descriptions
        19. 9.6.1.19 AUTO_MUTE_TIME Register (Offset = 51h) [reset = 0x00]
          1. Table 25. AUTO_MUTE_TIME Register Field Descriptions
        20. 9.6.1.20 ANA_CTRL Register (Offset = 53h) [reset = 0x00]
          1. Table 26. ANA_CTRL Register Field Descriptions
        21. 9.6.1.21 AGAIN Register (Offset = 54h) [reset = 0x00]
          1. Table 27. AGAIN Register Field Descriptions
        22. 9.6.1.22 BQ_WR_CTRL1 Register (Offset = 5Ch) [reset = 0x00]
          1. Table 28. BQ_WR_CTRL1 Register Field Descriptions
        23. 9.6.1.23 DAC_CTRL Register (Offset = 5Dh) [reset = 0xF8]
          1. Table 29. DAC_CTRL Register Field Descriptions
        24. 9.6.1.24 ADR_PIN_CTRL Register (Offset = 60h) [reset = 0h]
          1. Table 30. ADR_PIN_CTRL Register Field Descriptions
        25. 9.6.1.25 ADR_PIN_CONFIG Register (Offset = 61h) [reset = 0x00]
          1. Table 31. ADR_PIN_CONFIG Register Field Descriptions
        26. 9.6.1.26 DSP_MISC Register (Offset = 66h) [reset = 0h]
          1. Table 32. DSP_MISC Register Field Descriptions
        27. 9.6.1.27 DIE_ID Register (Offset = 67h) [reset = 0h]
          1. Table 33. DIE_ID Register Field Descriptions
        28. 9.6.1.28 POWER_STATE Register (Offset = 68h) [reset = 0x00]
          1. Table 34. POWER_STATE Register Field Descriptions
        29. 9.6.1.29 AUTOMUTE_STATE Register (Offset = 69h) [reset = 0x00]
          1. Table 35. AUTOMUTE_STATE Register Field Descriptions
        30. 9.6.1.30 PHASE_CTRL Register (Offset = 6Ah) [reset = 0x00]
          1. Table 36. PHASE_CTR Register Field Descriptions
        31. 9.6.1.31 SS_CTRL0 Register (Offset = 6Bh) [reset = 0x00]
          1. Table 37. SS_CTRL0 Register Field Descriptions
        32. 9.6.1.32 SS_CTRL1 Register (Offset = 6Ch) [reset = 0x00]
          1. Table 38. SS_CTRL1 Register Field Descriptions
        33. 9.6.1.33 SS_CTRL2 Register (Offset = 6Dh) [reset = 0x50]
          1. Table 39. SS_CTRL2 Register Field Descriptions
        34. 9.6.1.34 SS_CTRL3 Register (Offset = 6Eh) [reset = 0x11]
          1. Table 40. SS_CTRL3 Register Field Descriptions
        35. 9.6.1.35 SS_CTRL4 Register (Offset = 6Fh) [reset = 0x24]
          1. Table 41. SS_CTRL4 Register Field Descriptions
        36. 9.6.1.36 CHAN_FAULT Register (Offset = 70h) [reset = 0x00]
          1. Table 42. CHAN_FAULT Register Field Descriptions
        37. 9.6.1.37 GLOBAL_FAULT1 Register (Offset = 71h) [reset = 0h]
          1. Table 43. GLOBAL_FAULT1 Register Field Descriptions
        38. 9.6.1.38 GLOBAL_FAULT2 Register (Offset = 72h) [reset = 0h]
          1. Table 44. GLOBAL_FAULT2 Register Field Descriptions
        39. 9.6.1.39 OT WARNING Register (Offset = 73h) [reset = 0x00]
          1. Table 45. OT_WARNING Register Field Descriptions
        40. 9.6.1.40 PIN_CONTROL1 Register (Offset = 74h) [reset = 0x00]
          1. Table 46. PIN_CONTROL1 Register Field Descriptions
        41. 9.6.1.41 PIN_CONTROL2 Register (Offset = 75h) [reset = 0xF8]
          1. Table 47. PIN_CONTROL2 Register Field Descriptions
        42. 9.6.1.42 MISC_CONTROL Register (Offset = 76h) [reset = 0x00]
          1. Table 48. MISC_CONTROL Register Field Descriptions
        43. 9.6.1.43 FAULT_CLEAR Register (Offset = 78h) [reset = 0x00]
          1. Table 49. FAULT_CLEAR Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Bootstrap Capacitors
      2. 10.1.2 Inductor Selections
      3. 10.1.3 Power Supply Decoupling
      4. 10.1.4 Output EMI Filtering
    2. 10.2 Typical Applications
      1. 10.2.1 2.0 (Stereo BTL) System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Step 1: Hardware Integration
          2. 10.2.1.2.2 Step 2: Speaker Tuning
          3. 10.2.1.2.3 Step 3: Software Integration
        3. 10.2.1.3 Application Curves
          1. 10.2.1.3.1 Audio Performance
          2. 10.2.1.3.2 EN55022 Conducted Emissions Results with Ferrite Bead as output filter
          3. 10.2.1.3.3 EN55022 Radiated Emissions Results with Ferrite Bead as output filter
      2. 10.2.2 MONO (PBTL) Systems
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Advanced 2.1 System (Two TAS5805M Devices)
  11. 11Power Supply Recommendations
    1. 11.1 DVDD Supply
    2. 11.2 PVDD Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 General Guidelines for Audio Amplifiers
      2. 12.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 12.1.3 Optimizing Thermal Performance
        1. 12.1.3.1 Device, Copper, and Component Layout
        2. 12.1.3.2 Stencil Pattern
          1. 12.1.3.2.1 PCB footprint and Via Arrangement
          2. 12.1.3.2.2 Solder Stencil
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 器件命名规则
      2. 13.1.2 开发支持
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 支持多路输出配置
    • 2.0 模式(8Ω,21V,THD+N=1%)下可提供 2 × 23W 的功率
    • 单声道模式(4Ω,21V,THD+N=1%)下可提供 45W 的功率
  • 优异的音频性能
    • 1W、1kHz、PVDD = 12V 条件下 THD+N ≤ 0.03%
    • SNR ≥ 107dB(A 加权),噪声级别 < 40µVRMS
  • 低静态电流(混合调制)
    • PVDD = 13.5V 且使用 22µH + 0.68µF 滤波器的情况下为 16.5mA
  • 灵活的电源配置
    • PVDD:4.5V 至 26.4V
    • DVDD 和 I/O:1.8V 或 3.3V
  • 灵活的音频 I/O
    • I2S、LJ、RJ、TDM、3 线制数字音频接口(无需 MCLK)
    • 支持 32、44.1、48、88.2、96kHz 采样速率
    • 可支持音频监控、子通道或回声消除的 SDOUT
  • 增强的音频处理能力
    • 多频带高级 DRC 和 AGL
    • 2×15 个 BQ,热折回,直流阻断
    • 输入混合器,输出交叉开关,电平计
    • 5 个 BQ + 单频带 DRC + THD 管理器(用于低音炮通道)
    • 声场定位器 (SFS) 选项
  • 集成式自保护
    • 邻近的引脚对引脚短路不会造成损坏
    • 过流错误 (OCE)
    • 过热警告 (OTW)
    • 过热错误 (OTE)
    • 欠压/过压锁定 (UVLO/OVLO)
  • 可轻松进行系统集成
    • I2C 软件控制
    • 解决方案尺寸更小
      • 与开环器件相比,所需的无源器件更少
      • 对于 PVDD ≤ 14V 的大多数情况,可实现无电感器操作(铁氧体磁珠)