ZHCSGI2B July 2017 – October 2018 TAS2505-Q1
请参考 PDF 数据表获取器件具体的封装图。
Solder the Thermal PAD to GND plane. The plane will work as heat sink. For details about the corner pads size and location, refer to the 机械、封装和可订购信息 at the end of this document.
|A1||Internally connected to thermal pad. Leave floating or connect to the same plane as thermal pad.|