ZHCSRM6C November   2004  – January 2023 SN74AC04-Q1

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 16
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 应用信息免责声明
    1. 9.1 Power Supply Recommendations
    2. 9.2 Layout
      1. 9.2.1 Layout Guidelines
        1. 9.2.1.1 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Recommended Operating Conditions

MINMAX UNIT
VCC Supply voltage 2 6 V
VIH High-level input voltage VCC = 3 V 2.1 V
VCC = 4.5 V 3.15
VCC = 5.5 V3.85
VILLow-level input voltageVCC = 3 V0.9V
VCC = 4.5 V 1.35
VCC = 5.5 V 1.65
VIInput voltage0VCCV
VOOutput voltage0VCCV
IOHHigh-level output currentVCC = 3 V− 12 mA
VCC = 4.5 V − 24
VCC = 5.5 V − 24
IOLLow-level output currentVCC = 3 V12mA
VCC = 4.5 V 24
VCC = 5.5 V 24
∆t/∆v Input transition rise or fall rate 8 ns/V
TA Operating free-air temperature Q- suffix devices − 40 125 ° C
I- suffix devices − 40 85