ZHCSAC2C August   2012  – October 2018 PCM5121 , PCM5122

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化系统图
  4. 修订历史记录
  5. Device Comparison
  6. Pin Configuration and Functions
    1. 6.0.1 RHB Package I2C Mode (MODE1 tied to DGND and MODE2 tied to DVDD) Top View
    2. 6.0.2 RHB Package SPI Mode (MODE1 tied to DVDD) Top View
    3. 6.0.3 RHB Package Hardwired Mode (MODE1 tied to DGND, MODE2 tied to DGND) Top View
    4.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: SCK Input
    7. 7.7 Timing Requirements: XSMT
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Terminology
      2. 8.3.2 Audio Data Interface
        1. 8.3.2.1 Audio Serial Interface
        2. 8.3.2.2 PCM Audio Data Formats
        3. 8.3.2.3 Zero Data Detect
      3. 8.3.3 XSMT Pin (Soft Mute / Soft Un-Mute)
      4. 8.3.4 Audio Processing
        1. 8.3.4.1 PCM512x Audio Processing
          1. 8.3.4.1.1 Overview
          2. 8.3.4.1.2 Software
        2. 8.3.4.2 Interpolation Filter
        3. 8.3.4.3 Fixed Audio Processing Flow (Program 5)
          1. 8.3.4.3.1 Filter Programming Changes
          2. 8.3.4.3.2 Processing Blocks – Detailed Descriptions
          3. 8.3.4.3.3 Biquad Section
          4. 8.3.4.3.4 Dynamic Range Compression
          5. 8.3.4.3.5 Stereo Mixer
          6. 8.3.4.3.6 Stereo Multiplexer
          7. 8.3.4.3.7 Mono Mixer
          8. 8.3.4.3.8 Master Volume Control
          9. 8.3.4.3.9 Miscellaneous Coefficients
      5. 8.3.5 DAC Outputs
        1. 8.3.5.1 Analog Outputs
        2. 8.3.5.2 Recommended Output Filter for the PCM512x
        3. 8.3.5.3 Choosing Between VREF and VCOM Modes
          1. 8.3.5.3.1 Voltage Reference and Output Levels
          2. 8.3.5.3.2 Mode Switching Sequence, from VREF Mode to VCOM Mode
        4. 8.3.5.4 Digital Volume Control
          1. 8.3.5.4.1 Emergency Ramp-Down
        5. 8.3.5.5 Analog Gain Control
      6. 8.3.6 Reset and System Clock Functions
        1. 8.3.6.1 Clocking Overview
        2. 8.3.6.2 Clock Slave Mode With Master and System Clock (SCK) Input (4 Wire I2S)
        3. 8.3.6.3 Clock Slave Mode With BCK PLL to Generate Internal Clocks (3-Wire PCM)
        4. 8.3.6.4 Clock Generation Using the PLL
        5. 8.3.6.5 PLL Calculation
          1. 8.3.6.5.1 Examples:
            1. 8.3.6.5.1.1 Recommended PLL Settings
        6. 8.3.6.6 Clock Master Mode from Audio Rate Master Clock
        7. 8.3.6.7 Clock Master from a Non-Audio Rate Master Clock
    4. 8.4 Device Functional Modes
      1. 8.4.1 Choosing a Control Mode
        1. 8.4.1.1 Software Control
          1. 8.4.1.1.1 SPI Interface
            1. 8.4.1.1.1.1 Register Read and Write Operation
          2. 8.4.1.1.2 I2C Interface
            1. 8.4.1.1.2.1 Slave Address
            2. 8.4.1.1.2.2 Register Address Auto-Increment Mode
            3. 8.4.1.1.2.3 Packet Protocol
            4. 8.4.1.1.2.4 Write Register
            5. 8.4.1.1.2.5 Read Register
            6. 8.4.1.1.2.6 Timing Characteristics
      2. 8.4.2 VREF and VCOM Modes
    5. 8.5 Programming
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Distribution and Requirements
    2. 10.2 Recommended Powerdown Sequence
      1. 10.2.1 XSMT = 0
      2. 10.2.2 Clock Error Detect
      3. 10.2.3 Planned Shutdown
      4. 10.2.4 Unplanned Shutdown
    3. 10.3 External Power Sense Undervoltage Protection Mode
    4. 10.4 Power-On Reset Function
      1. 10.4.1 Power-On Reset, DVDD 3.3-V Supply
      2. 10.4.2 Power-On Reset, DVDD 1.8-V Supply
    5. 10.5 PCM512x Power Modes
      1. 10.5.1 Setting Digital Power Supplies and I/O Voltage Rails
      2. 10.5.2 Power Save Modes
      3. 10.5.3 Power Save Parameter Programming
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Register Maps
    1. 12.1 PCM512x Register Map
      1. 12.1.1 Detailed Register Descriptions
        1. 12.1.1.1 Register Map Summary
        2. 12.1.1.2 Page 0 Registers
        3. 12.1.1.3 Page 1 Registers
        4. 12.1.1.4 Page 44 Registers
        5. 12.1.1.5 Page 253 Registers
      2. 12.1.2 PLL Tables for Software Controlled Devices
      3. 12.1.3 Coefficient Data Formats
      4. 12.1.4 Power Down and Reset Behavior
  13. 13器件和文档支持
    1. 13.1 开发支持
    2. 13.2 文档支持
    3. 13.3 相关链接
    4. 13.4 接收文档更新通知
    5. 13.5 社区资源
    6. 13.6 商标
    7. 13.7 静电放电警告
    8. 13.8 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

PCM512x 器件属于单片 CMOS 集成电路系列,由立体声数模转换器 (DAC) 和采用薄型小外形尺寸 (TSSOP) 封装的附加支持电路组成。PCM512x 使用 TI 最新一代高级分段 DAC 架构产品,可实现出色的动态性能并提升针对时钟抖动的耐受度。

此PCM512x系列产品成员集成了带有可编程系数的预置音频处理功能,这使得开发人员能够改变他们产品内的内插滤波器,扬声器 EQ,动态范围控制以及平均音量控制的特性。

PCM512x 提供 2.1 VRMS 中央接地输出(设计人员无需在输出上连接隔直电容)以及传统意义上与单电源线路驱动器相关的外部静音电路。

集成线路驱动器支持低至 1kΩ 的负载,从而在性能上超过其他所有基于电荷泵的线路驱动器。PCM512x 支持低至 1kΩ 的负载,实际能够驱动多达 10 个并联产品(LCD TV、DVDR 和 AV 接收器等)。

器件上集成的 PLL 免除了对于系统时钟(通常称为主时钟)的需要,从而实现 3 线制 I2S 连接,同时减少系统电磁干扰 (EMI)。

器件信息(1)

器件型号 封装 封装尺寸(标称值)
PCM5121 TSSOP (28) 9.7mm × 4.4mm
PCM5122
  1. 如需了解所有可用封装,请参阅数据表末尾的封装选项附录。