SBOS153B September   2000  – January 2016 OPA541

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Current Limit
      2. 8.1.2 Heat Sinking
      3. 8.1.3 Safe Operating Area
      4. 8.1.4 Replacing Hybrid Power Amplifiers
    2. 8.2 Typical Applications
      1. 8.2.1 Clamping Output for EMF-Generating Loads
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply Requirements
          2. 8.2.1.2.2 Current Limit and SOA (Safe Operating Area)
          3. 8.2.1.2.3 Heat Sinking
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Paralleled Operation, Extended SOA
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Programmable Voltage Source
        1. 8.2.3.1 Design Requirements
      4. 8.2.4 16-Bit Programmable Voltage Source
        1. 8.2.4.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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10 Layout

10.1 Layout Guidelines

Figure 18 provides the recommended solder footprint for the TO-220 power package. The tab is electrically connected to the negative supply, V–. It may be desirable to isolate the tab of the TO-220 package from its mounting surface with a mica (or other film) insulator. For lowest overall thermal resistance, it is best to isolate the entire heat sink or OPA541 structure from the mounting surface rather than to use an insulator between the semiconductor and heat sink.

10.2 Layout Example

OPA541 OPA541layout_sbos153.gif Figure 18. Recommended Layout