SBOS483I July   2009  – May 2015 OPA2333-HT

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Voltage
      3. 7.3.3 Internal Offset Correction
      4. 7.3.4 Achieving Output Swing to the Operational Amplifier Negative Rail
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Precision, Low-Level Voltage-to-Current (V-I) Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Composite Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Temperature Measurement Application
      2. 8.3.2 Single Operational Amplifier Bridge Amplifier Application
      3. 8.3.3 Low-Side Current Monitor Application
      4. 8.3.4 Other Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General Layout Guidelines
      2. 10.1.2 DFN Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

For development support on this product, see the following:

  • High-Side V-I Converter, 0 V to 2 V to 0 mA to 100 mA, 1% Full-Scale Error, TIPD102
  • Low-Level V-to-I Converter Reference Design, 0-V to 5-V Input to 0-µA to 5-µA Output, TIPD107
  • 18-Bit, 1-MSPS, Serial Interface, microPower, Truly-Differential Input, SAR ADC, ADS8881
  • Very Low-Power, High-Speed, Rail-To-Rail Input/Output, Voltage Feedback Operational Amplifier, THS4281
  • Data Acquisition Optimized for Lowest Distortion, Lowest Noise, 18-bit, 1-MSPS Reference Design, TIPD115
  • Self-Calibrating, 16-Bit Analog-to-Digital Converter, ADS1100
  • 20-ppm/Degrees C Max, 100-µA, SOT23-3 Series Voltage Reference, REF3130
  • Precision, Low Drift, CMOS Instrumentation Amplifier, INA326, INA326

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.