ZHCSED2 November 2015 OPA2211-EP
For best operational performance of the device, use good PCB layout practices, including:
The primary issue with all semiconductor devices is junction temperature (TJ). The most obvious consideration is assuring that TJ never exceeds the absolute maximum rating specified for the device. However, addressing device thermal dissipation has benefits beyond protecting the device from damage. Even modest increases in junction temperature can decrease operational amplifier performance, and temperature-related errors can accumulate. Understanding the power generated by the device within the specific application and assessing the thermal effects on the error tolerance lead to a better understanding of system performance and thermal dissipation needs.