ZHCSHI9B December   2017  – June 2019 MSP432P4011T , MSP432P401VT , MSP432P401YT , MSP432P4111T , MSP432P411VT , MSP432P411YT

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram for MSP432P411xT Devices
    2. 4.2 Pin Diagram for MSP432P401xT Devices
    3. 4.3 Pin Attributes
    4. 4.4 Signal Descriptions
      1. Table 4-3 Signal Descriptions
    5. 4.5 Pin Multiplexing
    6. 4.6 Buffer Types
    7. 4.7 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Recommended External Components
    5. 5.5  Operating Mode VCC Ranges
    6. 5.6  Operating Mode CPU Frequency Ranges
    7. 5.7  Operating Mode Peripheral Frequency Ranges
    8. 5.8  Operating Mode Execution Frequency and Flash Wait-State Requirements
    9. 5.9  Current Consumption During Device Reset of the 100-Pin LQFP Package
    10. 5.10 Current Consumption in LDO-Based Active Modes – Dhrystone 2.1 Program
    11. 5.11 Current Consumption in DC/DC-Based Active Modes – Dhrystone 2.1 Program
    12. 5.12 Current Consumption in Low-Frequency Active Modes – Dhrystone 2.1 Program
    13. 5.13 Typical Characteristics of Active Mode Currents for CoreMark Program
    14. 5.14 Typical Characteristics of Active Mode Currents for Prime Number Program
    15. 5.15 Typical Characteristics of Active Mode Currents for Fibonacci Program
    16. 5.16 Typical Characteristics of Active Mode Currents for While(1) Program
    17. 5.17 Typical Characteristics of Low-Frequency Active Mode Currents for CoreMark Program
    18. 5.18 Current Consumption in LDO-Based LPM0 Modes
    19. 5.19 Current Consumption in DC/DC-Based LPM0 Modes
    20. 5.20 Current Consumption in Low-Frequency LPM0 Modes
    21. 5.21 Current Consumption in LPM3, LPM4 Modes
    22. 5.22 Current Consumption in LPM3 Modes With LCD
    23. 5.23 Current Consumption in LPM3.5, LPM4.5 Modes
    24. 5.24 Current Consumption of Digital Peripherals
    25. 5.25 Thermal Resistance Characteristics
    26. 5.26 Timing and Switching Characteristics
      1. 5.26.1  Reset Timing
        1. Table 5-1 Reset Recovery Latencies
        2. Table 5-2 External Reset Recovery Latencies
      2. 5.26.2  Peripheral Register Access Timing
        1. Table 5-3 Peripheral Register Access Latency
      3. 5.26.3  Mode Transition Timing
        1. Table 5-4 Active Mode Transition Latencies
        2. Table 5-5 LPM0 Mode Transition Latencies
        3. Table 5-6 LPM3, LPM4 Mode Transition Latencies
        4. Table 5-7 LPM3.5, LPM4.5 Mode Transition Latencies
      4. 5.26.4  Clock Specifications
        1. Table 5-8  Low-Frequency Crystal Oscillator, LFXT, Recommended Operating Conditions
        2. Table 5-9  Low-Frequency Crystal Oscillator, LFXT
        3. Table 5-10 High-Frequency Crystal Oscillator, HFXT, Recommended Operating Conditions
        4. Table 5-11 High-Frequency Crystal Oscillator, HFXT
        5. Table 5-12 DCO
        6. Table 5-13 DCO Overall Tolerance
        7. Table 5-14 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        8. Table 5-15 Internal-Reference Low-Frequency Oscillator (REFO) – 32.768-kHz Mode
        9. Table 5-16 Internal-Reference Low-Frequency Oscillator (REFO) – 128-kHz Mode
        10. Table 5-17 Module Oscillator (MODOSC)
        11. Table 5-18 System Oscillator (SYSOSC)
      5. 5.26.5  Power Supply System
        1. Table 5-19 VCORE Regulator (LDO) Characteristics
        2. Table 5-20 VCORE Regulator (DC/DC) Characteristics
        3. Table 5-21 PSS, VCCDET
        4. Table 5-22 PSS, SVSMH
      6. 5.26.6  Digital I/Os
        1. Table 5-23 Digital Inputs (Applies to Both Normal and High-Drive I/Os)
        2. Table 5-24 Digital Outputs, Normal I/Os
        3. Table 5-25 Digital Outputs, High-Drive I/Os
        4. Table 5-26 Pin-Oscillator Frequency, Ports Px
        5. 5.26.6.1   Typical Characteristics, Normal-Drive I/O Outputs at 3.0 V and 2.2 V
        6. 5.26.6.2   Typical Characteristics, High-Drive I/O Outputs at 3.0 V and 2.2 V
        7. 5.26.6.3   Typical Characteristics, Pin-Oscillator Frequency
      7. 5.26.7  Precision ADC
        1. Table 5-27 14-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-28 14-Bit ADC, Timing Parameters
        3. Table 5-29 14-Bit ADC, Linearity Parameters
        4. Table 5-30 14-Bit ADC, Dynamic Parameters
        5. Table 5-31 14-Bit ADC, Temperature Sensor and Built-In V1/2
        6. Table 5-32 14-Bit ADC, Internal Reference Buffers
        7. Table 5-33 14-Bit ADC, External Reference
        8. 5.26.7.1   Typical Characteristics of ADC
      8. 5.26.8  REF_A
        1. Table 5-35 REF_A, Built-In Reference
      9. 5.26.9  Comparator_E
        1. Table 5-36 Comparator_E Characteristics
      10. 5.26.10 LCD_F
        1. Table 5-37 LCD Recommended Operating Conditions
        2. Table 5-38 LCD Electrical Characteristics
      11. 5.26.11 eUSCI
        1. Table 5-39 eUSCI Clock Frequency (UART Mode)
        2. Table 5-40 eUSCI Switching Characteristics (UART Mode)
        3. Table 5-41 eUSCI Clock Frequency (SPI Master Mode)
        4. Table 5-42 eUSCI Switching Characteristics (SPI Master Mode)
        5. Table 5-43 eUSCI Switching Characteristics (SPI Slave Mode)
        6. Table 5-44 eUSCI Clock Frequency (I2C Mode)
        7. Table 5-45 eUSCI Switching Characteristics (I2C Mode)
      12. 5.26.12 Timer_A
        1. Table 5-46 Timer_A Characteristics
        2. Table 5-47 Timer32 Characteristics
      13. 5.26.13 Memories
        1. Table 5-48 Flash Memory Characteristics
        2. Table 5-49 Flash Characteristics for Operations Using MSP432 Peripheral Driver Libraries
        3. Table 5-50 Flash Characteristics for Stand-Alone Operations
        4. Table 5-51 SRAM Characteristics
      14. 5.26.14 Emulation and Debug
        1. Table 5-52 JTAG Timing Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Processor and Execution Features
      1. 6.2.1 Floating-Point Unit (FPU)
      2. 6.2.2 Memory Protection Unit (MPU)
      3. 6.2.3 Nested Vectored Interrupt Controller (NVIC)
      4. 6.2.4 SysTick
      5. 6.2.5 Debug and Trace Features
    3. 6.3  Memory Map
      1. 6.3.1 Code Zone Memory Map
        1. 6.3.1.1 Flash Memory Region
        2. 6.3.1.2 SRAM Region
        3. 6.3.1.3 ROM Region
      2. 6.3.2 SRAM Zone Memory Map
        1. 6.3.2.1 SRAM Region
        2. 6.3.2.2 SRAM Bit-Band Alias Region
      3. 6.3.3 Peripheral Zone Memory Map
        1. 6.3.3.1 Peripheral Region
        2. 6.3.3.2 Peripheral Bit Band Alias Region
      4. 6.3.4 Debug and Trace Peripheral Zone
    4. 6.4  Memories on MSP432P4x1xT
      1. 6.4.1 Flash Memory
        1. 6.4.1.1 Flash Main Memory (0x0000_0000 to 0x001F_FFFF)
        2. 6.4.1.2 Flash Information Memory (0x0020_0000 to 0x0020_7FFF)
        3. 6.4.1.3 Flash Operation
      2. 6.4.2 SRAM
        1. 6.4.2.1 SRAM Bank Enable Configuration
        2. 6.4.2.2 SRAM Block Retention Configuration and Backup Memory
        3. 6.4.2.3 Utility SRAM
      3. 6.4.3 ROM
    5. 6.5  DMA
      1. 6.5.1 DMA Source Mapping
      2. 6.5.2 DMA Completion Interrupts
      3. 6.5.3 DMA Access Privileges
    6. 6.6  Memory Map Access Details
      1. 6.6.1 Master and Slave Access Priority Settings
      2. 6.6.2 Memory Map Access Response
    7. 6.7  Interrupts
      1. 6.7.1 NMI
      2. 6.7.2 Device-Level User Interrupts
    8. 6.8  System Control
      1. 6.8.1 Device Resets
        1. 6.8.1.1 Power On/Off Reset (POR)
        2. 6.8.1.2 Reboot Reset
        3. 6.8.1.3 Hard Reset
        4. 6.8.1.4 Soft Reset
      2. 6.8.2 Power Supply System (PSS)
        1. 6.8.2.1 VCCDET
        2. 6.8.2.2 Supply Supervisor and Monitor for High Side (SVSMH)
        3. 6.8.2.3 Core Voltage Regulator
      3. 6.8.3 Power Control Manager (PCM)
        1. 6.8.3.1 Peripherals in LPM3 and LPM4
      4. 6.8.4 Clock System (CS)
        1. 6.8.4.1 LFXT
        2. 6.8.4.2 HFXT
        3. 6.8.4.3 DCO
        4. 6.8.4.4 Very-Low-Power Low-Frequency Oscillator (VLO)
        5. 6.8.4.5 Low-Frequency Reference Oscillator (REFO)
        6. 6.8.4.6 Module Oscillator (MODOSC)
        7. 6.8.4.7 System Oscillator (SYSOSC)
        8. 6.8.4.8 Fail-Safe Mechanisms
      5. 6.8.5 System Controller (SYSCTL_A)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O
        1. 6.9.1.1 Glitch Filtering on Digital I/Os
      2. 6.9.2  Port Mapping Controller (PMAPCTL)
        1. 6.9.2.1 Port Mapping Definitions
      3. 6.9.3  Timer_A
        1. 6.9.3.1 Timer_A Signal Connection Tables
      4. 6.9.4  Timer32
      5. 6.9.5  Enhanced Universal Serial Communication Interface (eUSCI)
      6. 6.9.6  Real-Time Clock (RTC_C)
      7. 6.9.7  Watchdog Timer (WDT_A)
      8. 6.9.8  Precision ADC
      9. 6.9.9  Comparator_E (COMP_E)
      10. 6.9.10 Shared Reference (REF_A)
      11. 6.9.11 LCD Controller (LCD_F)
      12. 6.9.12 CRC32
      13. 6.9.13 AES256 Accelerator
      14. 6.9.14 True Random Seed
    10. 6.10 Code Development and Debug
      1. 6.10.1 JTAG and Serial Wire Debug (SWD) Based Development, Debug, and Trace
      2. 6.10.2 Peripheral Halt Control
      3. 6.10.3 Bootloader (BSL)
      4. 6.10.4 Device Security
    11. 6.11 Performance Benchmarks
      1. 6.11.1 CoreMark/MHz Performance: 3.41
      2. 6.11.2 DMIPS/MHz (Dhrystone 2.1) Performance: 1.196
    12. 6.12 Input/Output Schematics
      1. 6.12.1  Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
      2. 6.12.2  Port P2, P2.0 to P2.3, Input/Output With Schmitt Trigger
      3. 6.12.3  Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
      4. 6.12.4  Port P9, P9.4 to P9.7, Input/Output With Schmitt Trigger
      5. 6.12.5  Port P10, P10.0 to P10.3, Input/Output With Schmitt Trigger
      6. 6.12.6  Port P2, P2.4 to P2.7, Input/Output With Schmitt Trigger
      7. 6.12.7  Port P7, P7.0 to P7.2, Input/Output With Schmitt Trigger
      8. 6.12.8  Port P7, P7.3, Input/Output With Schmitt Trigger
      9. 6.12.9  Port P9, P9.2 and P9.3, Input/Output With Schmitt Trigger
      10. 6.12.10 Port P4, P4.2 to P4.7, Input/Output With Schmitt Trigger
      11. 6.12.11 Port P5, P5.0 to P5.5, Input/Output With Schmitt Trigger
      12. 6.12.12 Port P4, P4.0 to P4.1, Input/Output With Schmitt Trigger
      13. 6.12.13 Port P6, P6.0 and P6.1, Input/Output With Schmitt Trigger
      14. 6.12.14 Port P8, P8.2 to P8.7, Input/Output With Schmitt Trigger
      15. 6.12.15 Port P9, P9.0 and P9.1, Input/Output With Schmitt Trigger
      16. 6.12.16 Port P5, P5.6 and P5.7, Input/Output With Schmitt Trigger
      17. 6.12.17 Port P6, P6.2 to P6.5, Input/Output With Schmitt Trigger
      18. 6.12.18 Port P6, P6.6 and P6.7, Input/Output With Schmitt Trigger
      19. 6.12.19 Port P8, P8.0 and P8.1, Input/Output With Schmitt Trigger
      20. 6.12.20 Port P10, P10.4 and P10.5, Input/Output With Schmitt Trigger
      21. 6.12.21 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
      22. 6.12.22 Port PJ, PJ.0 and PJ.1 Input/Output With Schmitt Trigger
      23. 6.12.23 Port PJ, PJ.2 and PJ.3 Input/Output With Schmitt Trigger
      24. 6.12.24 Port PJ, PJ.4 and PJ.5 Input/Output With Schmitt Trigger
      25. 6.12.25 Ports SWCLKTCK and SWDIOTMS With Schmitt Trigger
    13. 6.13 Device Descriptors (TLV)
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 Arm Cortex-M4F ROM Table Based Part Number
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 General Layout Recommendations
      4. 7.1.4 Do's and Don'ts
    2. 7.2 Peripheral and Interface-Specific Design Information
      1. 7.2.1 Precision ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1  开始使用
    2. 8.2  器件命名规则
    3. 8.3  工具与软件
    4. 8.4  文档支持
    5. 8.5  相关链接
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PZ|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

SimpleLink MSP432P411xT 和 MSP432P401xT 微控制器 (MCU) 是具有集成式 16 位精密 ADC 的优化型无线主机 MCU,可借助 FPU 和 DSP 扩展提供超低功耗性能,其中包括 100μA/MHz 的工作功耗和 14.4µA 的待机功耗。作为优化的无线主机 MCU,MSP432P411xT 和 MSP432P401xT 可让开发人员向 基于 SimpleLink 无线连接解决方案的应用中添加高精度模拟和存储器扩展。

MSP432P411xT 和 MSP432P401xT 器件是 SimpleLink MCU 平台的一部分,包含 Wi-Fi、低功耗蓝牙、低于 1GHz和主机 MCU。它们均共用一个通用、简单易用的开发环境,其中包含单核软件开发套件 (SDK) 和丰富的工具集。只需进行一次 SimpleLink 平台集成,便可将配置文件中的任意器件组合添加到设计中。SimpleLink 平台的最终目标是确保设计要求变更时,完全重复使用代码。更多详细信息,请访问 www.ti.com.cn/simplelink

MSP432P411xT 和 MSP432P401xT MCU 具有配套的综合生态系统,其中包含工具、软件、文档、培训和支持,旨在帮助您迅速开始开发。MSP-EXP432P4111有了 LaunchPad™开发套件或 MSP-TS432PZ100 目标插座板(附带额外的 MCU 样片)以及免费的 SimpleLink MSP432 SDK,即可开始开发。

器件信息(1)

器件型号 封装 封装尺寸(2)
MSP432P4111TPZ
MSP432P411YTPZ
MSP432P411VTPZ
LQFP (100) 14mm x 14mm
MSP432P4011TRGC
MSP432P401YTRGC
MSP432P401VTRGC
VQFN (64) 9mm x 9mm
要获得所有可用器件的最新部件、封装和订购信息,请参见封装选项附录Section 9)或浏览 TI 网站 www.ti.com.cn
这里显示的尺寸为近似值。要获得包含误差值的封装尺寸,请参见机械数据Section 9)。