ZHCSEA0E October   2015  – August 2019 MSP430FR2433

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1       Absolute Maximum Ratings
    2. 5.2       ESD Ratings
    3. 5.3       Recommended Operating Conditions
    4. 5.4       Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5       Active Mode Supply Current Per MHz
    6. 5.6       Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7       Low-Power Mode (LPM3 and LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8       Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9       Typical Characteristics - Low-Power Mode Supply Currents
    10. Table 5-1 Typical Characteristics – Current Consumption Per Module
    11. 5.10      Thermal Resistance Characteristics
    12. 5.11      Timing and Switching Characteristics
      1. 5.11.1  Power Supply Sequencing
        1. Table 5-2 PMM, SVS and BOR
      2. 5.11.2  Reset Timing
        1. Table 5-3 Wake-up Times From Low-Power Modes and Reset
      3. 5.11.3  Clock Specifications
        1. Table 5-4 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-5 DCO FLL, Frequency
        3. Table 5-6 DCO Frequency
        4. Table 5-7 REFO
        5. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. Table 5-9 Module Oscillator (MODOSC)
      4. 5.11.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.11.4.1   Typical Characteristics – Outputs at 3 V and 2 V
      5. 5.11.5  VREF+ Built-in Reference
        1. Table 5-12 VREF+
      6. 5.11.6  Timer_A
        1. Table 5-13 Timer_A
      7. 5.11.7  eUSCI
        1. Table 5-14 eUSCI (UART Mode) Clock Frequency
        2. Table 5-15 eUSCI (UART Mode)
        3. Table 5-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-17 eUSCI (SPI Master Mode)
        5. Table 5-18 eUSCI (SPI Slave Mode)
        6. Table 5-19 eUSCI (I2C Mode)
      8. 5.11.8  ADC
        1. Table 5-20 ADC, Power Supply and Input Range Conditions
        2. Table 5-21 ADC, 10-Bit Timing Parameters
        3. Table 5-22 ADC, 10-Bit Linearity Parameters
      9. 5.11.9  FRAM
        1. Table 5-23 FRAM
      10. 5.11.10 Debug and Emulation
        1. Table 5-24 JTAG, Spy-Bi-Wire Interface
        2. Table 5-25 JTAG, 4-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Standard Interface
    7. 6.7  Spy-Bi-Wire Interface (SBW)
    8. 6.8  FRAM
    9. 6.9  Memory Protection
    10. 6.10 Peripherals
      1. 6.10.1  Power-Management Module (PMM)
      2. 6.10.2  Clock System (CS) and Clock Distribution
      3. 6.10.3  General-Purpose Input/Output Port (I/O)
      4. 6.10.4  Watchdog Timer (WDT)
      5. 6.10.5  System (SYS) Module
      6. 6.10.6  Cyclic Redundancy Check (CRC)
      7. 6.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.10.8  Timers (Timer0_A3, Timer1_A3, Timer2_A2 and Timer3_A2)
      9. 6.10.9  Hardware Multiplier (MPY)
      10. 6.10.10 Backup Memory (BAKMEM)
      11. 6.10.11 Real-Time Clock (RTC)
      12. 6.10.12 10-Bit Analog-to-Digital Converter (ADC)
      13. 6.10.13 Embedded Emulation Module (EEM)
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1 Input/Output With Schmitt Trigger
      2. 6.11.2 Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      3. 6.11.3 Port P2 (P2.3 to P2.7) Input/Output With Schmitt Trigger
      4. 6.11.4 Port P3 (P3.0 to P3.2) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors
    13. 6.13 Memory
      1. 6.13.1 Memory Organization
      2. 6.13.2 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1 入门和后续步骤
    2. 8.2 器件命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 社区资源
    6. 8.6 商标
    7. 8.7 静电放电警告
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Signal Descriptions

Table 4-2 describes the device signals.

Table 4-2 Signal Descriptions

FUNCTION SIGNAL NAME PIN NUMBER PIN TYPE(1) DESCRIPTION
RGE YQW
ADC A0 7 B1 I Analog input A0
A1 8 A1 I Analog input A1
A2 9 B2 I Analog input A2
A3 10 A2 I Analog input A3
A4 3 D1 I Analog input A4
A5 4 C2 I Analog input A5
A6 5 C3 I Analog input A6
A7 6 B3 I Analog input A7
Veref+ 7 B1 I ADC positive reference
Veref- 9 B2 I ADC negative reference
Clock ACLK 11 A3 O ACLK output
MCLK 10 A2 O MCLK output
SMCLK 6 B3 O SMCLK output
XIN 22 E3 I Input terminal for crystal oscillator
XOUT 21 E4 O Output terminal for crystal oscillator
Debug SBWTCK 2 D2 I Spy-Bi-Wire input clock
SBWTDIO 1 E1 I/O Spy-Bi-Wire data input/output
TCK 3 D1 I Test clock
TCLK 5 C3 I Test clock input
TDI 5 C3 I Test data input
TDO 6 B3 O Test data output
TEST 2 D2 I Test Mode pin – selected digital I/O on JTAG pins
TMS 4 C2 I Test mode select
GPIO P1.0 7 B1 I/O General-purpose I/O
P1.1 8 A1 I/O General-purpose I/O
P1.2 9 B2 I/O General-purpose I/O
P1.3 10 A2 I/O General-purpose I/O
P1.4 3 D1 I/O General-purpose I/O(2)
P1.5 4 C2 I/O General-purpose I/O(2)
P1.6 5 C3 I/O General-purpose I/O(2)
P1.7 6 B3 I/O General-purpose I/O(2)
P2.0 21 E4 I/O General-purpose I/O
P2.1 22 E3 I/O General-purpose I/O
P2.2 11 A3 I/O General-purpose I/O
P2.3 13 A5 I/O General-purpose I/O
P2.4 15 I/O General-purpose I/O
P2.5 16 B4 I/O General-purpose I/O
P2.6 17 B5 I/O General-purpose I/O
P2.7 19 E5 I/O General-purpose I/O
P3.0 12 A4 I/O General-purpose I/O
P3.1 14 I/O General-purpose I/O
P3.2 20 D4 I/O General-purpose I/O
I2C UCB0SCL 10 A2 I/O eUSCI_B0 I2C clock
UCB0SDA 9 B2 I/O eUSCI_B0 I2C data
Power DVCC 24 E2 P Power supply
DVSS 23 D3 P Power ground
VREF+ 3 D1 P Output of positive reference voltage with ground as reference
SPI UCA0CLK 5 C3 I/O eUSCI_A0 SPI clock input/output
UCA0SIMO 3 D1 I/O eUSCI_A0 SPI slave in/master out
UCA0SOMI 4 C2 I/O eUSCI_A0 SPI slave out/master in
UCA0STE 6 B3 I/O eUSCI_A0 SPI slave transmit enable
UCA1CLK 15 I/O eUSCI_A1 SPI clock input/output
UCA1SIMO 17 B5 I/O eUSCI_A1 SPI slave in/master out
UCA1SOMI 16 B4 I/O eUSCI_A1 SPI slave out/master in
UCA1STE 14 I/O eUSCI_A1 SPI slave transmit enable
UCB0CLK 8 A1 I/O eUSCI_B0 clock input/output
UCB0SIMO 9 B2 I/O eUSCI_B0 SPI slave in/master out
UCB0SOMI 10 A2 I/O eUSCI_B0 SPI slave out/master in
UCB0STE 7 B1 I/O eUSCI_B0 slave transmit enable
System NMI 1 E1 I Nonmaskable interrupt input
RST 1 E1 I Active-low reset input
Timer_A TA0.1 8 A1 I/O Timer TA0 CCR1 capture: CCI1A input, compare: Out1 outputs
TA0.2 9 B2 I/O Timer TA0 CCR2 capture: CCI2A input, compare: Out2 outputs
TA0CLK 7 B1 I Timer clock input TACLK for TA0
TA1.1 4 C2 I/O Timer TA1 CCR1 capture: CCI1A input, compare: Out1 outputs
TA1.2 3 D1 I/O Timer TA1 CCR2 capture: CCI2A input, compare: Out2 outputs
TA1CLK 5 C3 I Timer clock input TACLK for TA1
UART UCA0RXD 4 C2 I eUSCI_A0 UART receive data
UCA0TXD 3 D1 O eUSCI_A0 UART transmit data
UCA1RXD 16 B4 I eUSCI_A1 UART receive data
UCA1TXD 17 B5 O eUSCI_A1 UART transmit data
No connection NC C4, C5, D5 I/O No connection
VQFN Pad VQFN thermal pad Pad N/A VQFN package exposed thermal pad. Connection to VSS is recommended
Pin Types: I = Input, O = Output, I/O = Input or Output, P = Power
Because this pin is multiplexed with the JTAG function, TI recommends disabling the pin interrupt function while in JTAG debug to prevent collisions.