ZHCSEA0E October   2015  – August 2019 MSP430FR2433

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1       Absolute Maximum Ratings
    2. 5.2       ESD Ratings
    3. 5.3       Recommended Operating Conditions
    4. 5.4       Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5       Active Mode Supply Current Per MHz
    6. 5.6       Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7       Low-Power Mode (LPM3 and LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8       Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9       Typical Characteristics - Low-Power Mode Supply Currents
    10. Table 5-1 Typical Characteristics – Current Consumption Per Module
    11. 5.10      Thermal Resistance Characteristics
    12. 5.11      Timing and Switching Characteristics
      1. 5.11.1  Power Supply Sequencing
        1. Table 5-2 PMM, SVS and BOR
      2. 5.11.2  Reset Timing
        1. Table 5-3 Wake-up Times From Low-Power Modes and Reset
      3. 5.11.3  Clock Specifications
        1. Table 5-4 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-5 DCO FLL, Frequency
        3. Table 5-6 DCO Frequency
        4. Table 5-7 REFO
        5. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. Table 5-9 Module Oscillator (MODOSC)
      4. 5.11.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.11.4.1   Typical Characteristics – Outputs at 3 V and 2 V
      5. 5.11.5  VREF+ Built-in Reference
        1. Table 5-12 VREF+
      6. 5.11.6  Timer_A
        1. Table 5-13 Timer_A
      7. 5.11.7  eUSCI
        1. Table 5-14 eUSCI (UART Mode) Clock Frequency
        2. Table 5-15 eUSCI (UART Mode)
        3. Table 5-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-17 eUSCI (SPI Master Mode)
        5. Table 5-18 eUSCI (SPI Slave Mode)
        6. Table 5-19 eUSCI (I2C Mode)
      8. 5.11.8  ADC
        1. Table 5-20 ADC, Power Supply and Input Range Conditions
        2. Table 5-21 ADC, 10-Bit Timing Parameters
        3. Table 5-22 ADC, 10-Bit Linearity Parameters
      9. 5.11.9  FRAM
        1. Table 5-23 FRAM
      10. 5.11.10 Debug and Emulation
        1. Table 5-24 JTAG, Spy-Bi-Wire Interface
        2. Table 5-25 JTAG, 4-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Standard Interface
    7. 6.7  Spy-Bi-Wire Interface (SBW)
    8. 6.8  FRAM
    9. 6.9  Memory Protection
    10. 6.10 Peripherals
      1. 6.10.1  Power-Management Module (PMM)
      2. 6.10.2  Clock System (CS) and Clock Distribution
      3. 6.10.3  General-Purpose Input/Output Port (I/O)
      4. 6.10.4  Watchdog Timer (WDT)
      5. 6.10.5  System (SYS) Module
      6. 6.10.6  Cyclic Redundancy Check (CRC)
      7. 6.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.10.8  Timers (Timer0_A3, Timer1_A3, Timer2_A2 and Timer3_A2)
      9. 6.10.9  Hardware Multiplier (MPY)
      10. 6.10.10 Backup Memory (BAKMEM)
      11. 6.10.11 Real-Time Clock (RTC)
      12. 6.10.12 10-Bit Analog-to-Digital Converter (ADC)
      13. 6.10.13 Embedded Emulation Module (EEM)
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1 Input/Output With Schmitt Trigger
      2. 6.11.2 Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      3. 6.11.3 Port P2 (P2.3 to P2.7) Input/Output With Schmitt Trigger
      4. 6.11.4 Port P3 (P3.0 to P3.2) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors
    13. 6.13 Memory
      1. 6.13.1 Memory Organization
      2. 6.13.2 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1 入门和后续步骤
    2. 8.2 器件命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 社区资源
    6. 8.6 商标
    7. 8.7 静电放电警告
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Attributes

Table 4-1 lists the attributes of all pins.

Table 4-1 Pin Attributes

PIN NUMBER SIGNAL NAME(1)(4) SIGNAL TYPE(2) BUFFER TYPE(3) POWER SOURCE(5) RESET STATE AFTER BOR(6)
RGE YQW
1 E1 RST (RD) I LVCMOS DVCC OFF
NMI I LVCMOS DVCC
SBWTDIO I/O LVCMOS DVCC
2 D2 TEST (RD) I LVCMOS DVCC OFF
SBWTCK I LVCMOS DVCC
3 D1 P1.4 (RD) I/O LVCMOS DVCC OFF
UCA0TXD O LVCMOS DVCC
UCA0SIMO I/O LVCMOS DVCC
TA1.2 I/O LVCMOS DVCC
TCK I LVCMOS DVCC
A4 I Analog DVCC
VREF+ O Power DVCC
4 C2 P1.5 (RD) I/O LVCMOS DVCC OFF
UCA0RXD I LVCMOS DVCC
UCA0SOMI I/O LVCMOS DVCC
TA1.1 I/O LVCMOS DVCC
TMS I LVCMOS DVCC
A5 I Analog DVCC
5 C3 P1.6 (RD) I/O LVCMOS DVCC OFF
UCA0CLK I/O LVCMOS DVCC
TA1CLK I LVCMOS DVCC
TDI I LVCMOS DVCC
TCLK I LVCMOS DVCC
A6 I Analog DVCC
6 B3 P1.7 (RD) I/O LVCMOS DVCC OFF
UCA0STE I/O LVCMOS DVCC
SMCLK O LVCMOS DVCC
TDO O LVCMOS DVCC
A7 I Analog DVCC
7 B1 P1.0 (RD) I/O LVCMOS DVCC OFF
UCB0STE I/O LVCMOS DVCC
TA0CLK I LVCMOS DVCC
A0 I Analog DVCC
Veref+ I Power DVCC
8 A1 P1.1 (RD) I/O LVCMOS DVCC OFF
UCB0CLK I/O LVCMOS DVCC
TA0.1 I/O LVCMOS DVCC
A1 I Analog DVCC
9 B2 P1.2 (RD) I/O LVCMOS DVCC OFF
UCB0SIMO I/O LVCMOS DVCC
UCB0SDA I/O LVCMOS DVCC
TA0.2 I/O LVCMOS DVCC
A2 I Analog DVCC
Veref- I Power DVCC
10 A2 P1.3 (RD) I/O LVCMOS DVCC OFF
UCB0SOMI I/O LVCMOS DVCC
UCB0SCL I/O LVCMOS DVCC
MCLK O LVCMOS DVCC
A3 I Analog DVCC
11 A3 P2.2 (RD) I/O LVCMOS DVCC OFF
ACLK I/O LVCMOS DVCC
12 A4 P3.0 I/O LVCMOS DVCC OFF
13 A5 P2.3 I/O LVCMOS DVCC OFF
14 P3.1 (RD) I/O LVCMOS DVCC OFF
UCA1STE I/O LVCMOS DVCC
15 P2.4 (RD) I/O LVCMOS DVCC OFF
UCA1CLK I/O LVCMOS DVCC
16 B4 P2.5 (RD) I/O LVCMOS DVCC OFF
UCA1RXD I LVCMOS DVCC
UCA1SOMI I/O LVCMOS DVCC
17 B5 P2.6 (RD) I/O LVCMOS DVCC OFF
UCA1TXD O LVCMOS DVCC
UCA1SIMO I/O LVCMOS DVCC
18 DVSS P Power DVCC N/A
C5 NC
19 E5 P2.7 I/O LVCMOS DVCC OFF
20 D4 P3.2 I/O LVCMOS DVCC OFF
21 E4 P2.0 (RD) I/O LVCMOS DVCC OFF
XOUT O LVCMOS DVCC
22 E3 P2.1 (RD) I/O LVCMOS DVCC OFF
XIN I LVCMOS DVCC
23 D3 DVSS P Power DVCC N/A
24 E2 DVCC P Power DVCC N/A
Signals names with (RD) denote the reset default pin name.
Signal Types: I = Input, O = Output, I/O = Input or Output
Buffer Types: LVCMOS, Analog, or Power (see Table 4-3)
To determine the pin mux encodings for each pin, see Section 6.11, Input/Output Diagrams.
The power source shown in this table is the I/O power source, which may differ from the module power source.
Reset States:
OFF = High-impedance with Schmitt trigger and pullup or pulldown (if available) disabled
N/A = Not applicable