ZHCSER1B September   2013  – September 2018 MSP430F5232 , MSP430F5234 , MSP430F5237 , MSP430F5239 , MSP430F5242 , MSP430F5244 , MSP430F5247 , MSP430F5249

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
      2. 4.2.1     RST/NMI and RSTDVCC/SBWTDIO Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3, RSTDVCC/SBWTDIO, RST/NMI)
    8. 5.8  Inputs – Interrupts (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    12. 5.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, P7.0 to P7.5, PJ.0 to PJ.3)
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT2
    17. 5.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    18. 5.18 Internal Reference, Low-Frequency Oscillator (REFO)
    19. 5.19 DCO Frequency
    20. 5.20 PMM, Brownout Reset (BOR)
    21. 5.21 PMM, Core Voltage
    22. 5.22 PMM, SVS High Side
    23. 5.23 PMM, SVM High Side
    24. 5.24 PMM, SVS Low Side
    25. 5.25 PMM, SVM Low Side
    26. 5.26 Wake-up Times From Low-Power Modes and Reset
    27. 5.27 Timer_A
    28. 5.28 Timer_B
    29. 5.29 USCI (UART Mode) Clock Frequency
    30. 5.30 USCI (UART Mode)
    31. 5.31 USCI (SPI Master Mode) Clock Frequency
    32. 5.32 USCI (SPI Master Mode)
    33. 5.33 USCI (SPI Slave Mode)
    34. 5.34 USCI (I2C Mode)
    35. 5.35 10-Bit ADC, Power Supply and Input Range Conditions
    36. 5.36 10-Bit ADC, Timing Parameters
    37. 5.37 10-Bit ADC, Linearity Parameters
    38. 5.38 REF, External Reference
    39. 5.39 REF, Built-In Reference
    40. 5.40 Comparator_B
    41. 5.41 Flash Memory
    42. 5.42 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Port Mapping Controller (Link to User's Guide)
      3. 6.9.3  Oscillator and System Clock (Link to User's Guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to User's Guide)
      5. 6.9.5  Hardware Multiplier (MPY) (Link to User's Guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to User's Guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to User's Guide)
      8. 6.9.8  System (SYS) Module (Link to User's Guide)
      9. 6.9.9  DMA Controller (Link to User's Guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to User's Guide)
      12. 6.9.12 TA1 (Link to User's Guide)
      13. 6.9.13 TA2 (Link to User's Guide)
      14. 6.9.14 TB0 (Link to User's Guide)
      15. 6.9.15 Comparator_B (Link to User's Guide)
      16. 6.9.16 ADC10_A (Link to User's Guide)
      17. 6.9.17 CRC16 (Link to User's Guide)
      18. 6.9.18 Reference (REF) Module Voltage Reference (Link to User's Guide)
      19. 6.9.19 Embedded Emulation Module (EEM) (S Version) (Link to User's Guide)
      20. 6.9.20 Peripheral File Map
    10. 6.10 Input/Output Diagrams
      1. 6.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      8. 6.10.8  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      9. 6.10.9  Port P7 (P7.0 to P7.5) Input/Output With Schmitt Trigger
      10. 6.10.10 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      11. 6.10.11 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 Device Descriptors
  7. 7器件和文档支持
    1. 7.1  入门和后续步骤
    2. 7.2  Device Nomenclature
    3. 7.3  工具与软件
    4. 7.4  文档支持
    5. 7.5  相关链接
    6. 7.6  社区资源
    7. 7.7  商标
    8. 7.8  静电放电警告
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1.3 说明

TI MSP 系列超低功耗微控制器种类繁多，各成员器件配备不同的外设集以满足各类应用的 需求。此架构与多种低功耗模式配合使用，是延长便携式测量应用电池寿命的最优 选择。该器件 具有 一个强大的 16 位 RISC CPU，使用 16 位寄存器以及常数发生器，以便获得最高编码效率。此数控振荡器 (DCO) 可使器件在 3.5µs（典型值）内从低功率模式唤醒至激活模式。

MSP430F524x 系列属于微控制器，配有四个 16 位定时器、一个高性能 10 位 ADC、两个 USCI、一个硬件乘法器、DMA、一个比较器以及一个具有报警功能的 RTC 模块。

MSP430F523x 系列微控制器包含 MSP430F524x 系列除 ADC 以外的所有外设。

有关完整的模块说明，请参阅《MSP430F5xx 和 MSP430F6xx 系列用户指南》。

器件信息(1)

器件型号 封装 封装尺寸(2)
MSP430F5249IRGC VQFN (64) 9mm x 9mm
MSP430F5249IZQE BGA (80) 5mm x 5mm
MSP430F5244IRGZ VQFN (48) 7mm x 7mm
(1) 要获得所有可用器件的最新部件、封装和订购信息，请参见封装选项附录（Section 8）或浏览 TI 网站 www.ti.com.cn。
(2) 这里显示的尺寸为近似值。要获得包含误差值的封装尺寸，请参见机械数据（Section 8）。