SLLS410N January   2000  – June 2017 MAX3232

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics — Device
    6. 6.6 Electrical Characteristics — Driver
    7. 6.7 Electrical Characteristics — Receiver
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC powered by 3 V to 5.5 V
      2. 8.4.2 VCC unpowered, VCC = 0 V
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Standard Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DB|16
  • PW|16
  • DW|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range(2) –0.3 6 V
V+ Positive output supply voltage range(2) –0.3 7 V
V– Negative output supply voltage range(2) –7 0.3 V
V+ – V– Supply voltage difference(2) 13 V
VI Input voltage range Drivers –0.3 6 V
Receivers –25 25
VO Output voltage range Drivers –13.2 13.2 V
Receivers –0.3 VCC + 0.3
TJ Operating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
RIN , DOUT, and GND pins (1)
15000 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
All other pins(1)
3000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

(see Figure 6)(1)
MIN NOM MAX UNIT
VCC Supply voltage VCC = 3.3 V 3 3.3 3.6 V
VCC = 5 V 4.5 5 5.5
VIH Driver high-level input voltage DIN VCC = 3.3 V 2 V
VCC = 5 V 2.4
VIL Driver low-level input voltage DIN 0.8 V
VI Driver input voltage DIN 0 5.5 V
Receiver input voltage RIN –25 25
TA Operating free-air temperature MAX3232C 0 70 °C
MAX3232I –40 85
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.

Thermal Information

THERMAL METRIC(1) MAX3232 UNIT
SOIC (D) SSOP (DB) SOIC (DW) TSSOP (PW)
16 PINS
RθJA Junction-to-ambient thermal resistance 78.1 93.5 66.6 101.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.5 45.8 32.4 32.9 °C/W
RθJB Junction-to-board thermal resistance 36.3 44.6 31.9 47.5 °C/W
ψJT Junction-to-top characterization parameter 8.0 11.1 8.4 1.9 °C/W
ψJB Junction-to-board characterization parameter 36.0 44 31.5 46.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Electrical Characteristics — Device

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
ICC Supply current No load, VCC = 3.3 V to 5 V 0.3 1 mA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.

Electrical Characteristics — Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 V
VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 V
IIH High-level input current VI = VCC ±0.01 ±1 μA
IIL Low-level input current VI at GND ±0.01 ±1 μA
IOS(2) Short-circuit output current VCC = 3.6 V VO = 0 V ±35 ±60 mA
VCC = 5.5 V VO = 0 V
rO Output resistance VCC, V+, and V– = 0 V VO = ±2 V 300 10M Ω
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5

Electrical Characteristics — Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VOH High-level output voltage IOH = –1 mA VCC – 0.6 VCC – 0.1 V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VIT+ Positive-going input threshold voltage VCC = 3.3 V 1.5 2.4 V
VCC = 5 V 1.8 2.4
VIT– Negative-going input threshold voltage VCC = 3.3 V 0.6 1.2 V
VCC = 5 V 0.8 1.5
Vhys Input hysteresis (VIT+ – VIT–) 0.3 V
rI Input resistance VI = ±3 V to ±25 V 3 5 7
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.

Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Maximum data rate RL = 3 kΩ, CL = 1000 pF 150 250 kbit/s
One DOUT switching, See Figure 3
tsk(p) Driver Pulse skew(2) RL = 3 kΩ to 7 kΩ, CL = 150 to 2500 pF 300 ns
See Figure 4
SR(tr) Slew rate, transition region
(see Figure 3)
RL = 3 kΩ to 7 kΩ,
VCC = 5 V
CL = 150 to 1000 pF 6 30 V/μs
CL = 150 to 2500 pF 4 30
tPLH®) Propagation delay time, low- to high-level output CL = 150 pF 300 ns
tPHL®) Propagation delay time, high- to low-level output 300
tsk(p) Receiver Pulse skew(3) 300
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.

Typical Characteristics

VCC = 3.3 V
MAX3232 max3232_voh_chart.png Figure 1. DOUT VOH vs Load Current, Both Drivers Loaded
MAX3232 max3232_vol_chart.png Figure 2. DOUT VOL vs Load Current, Both Drivers Loaded