ZHCSI24O September   2000  – April 2018 LMV7235 , LMV7239

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      电源电流与电源电压间的关系
      2.      传播延迟与过驱动
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, 2.7 V
    6. 6.6 Electrical Characteristics, 5 V
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage: LMV7239
      3. 7.3.3 Output Stage: LMV7235
    4. 7.4 Device Functional Modes
      1. 7.4.1 Capacitive and Resistive Loads
      2. 7.4.2 Noise
      3. 7.4.3 Hysteresis
        1. 7.4.3.1 Inverting Comparator With Hysteresis
        2. 7.4.3.2 Non-Inverting Comparator With Hysteresis
      4. 7.4.4 Zero Crossing Detector
        1. 7.4.4.1 Zero Crossing Detector With Hysteresis
      5. 7.4.5 Threshold Detector
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Square Wave Oscillator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Crystal Oscillator
      3. 8.2.3 Infrared (IR) Receiver
      4. 8.2.4 Window Detector
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) LMV7235, LMV7239 UNIT
DGK (SC70) DBV (SOT-23)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 478 265 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.