ZHCSF36A December   2015  – May 2016 LMR16010

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency Peak Current Mode Control
      2. 7.3.2  Slope Compensation
      3. 7.3.3  Sleep-mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Adjustable Output Voltage
      6. 7.3.6  Enable and Adjustable Under-voltage Lockout
      7. 7.3.7  Switching Frequency and Synchronization (RT/SYNC)
      8. 7.3.8  Power Good (PGOOD)
      9. 7.3.9  Over Current and Short Circuit Protection
      10. 7.3.10 Overvoltage Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Set-Point
        2. 8.2.2.2 Switching Frequency
        3. 8.2.2.3 Output Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Schottky Diode Selection
        6. 8.2.2.6 Input Capacitor Selection
        7. 8.2.2.7 Bootstrap Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted) (1)
MIN MAX UNIT
Input Voltages VIN, EN to GND -0.3 65 V
BOOT to GND -0.3 71
FB to GND -0.3 7
RT/SYNC to GND -0.3 3.6
PGOOD to GND -0.3 7
Output Voltages BOOT to SW 6.5 V
SW to GND -3 65
TJ Junction temperature -40 150 °C
Tstg Storage temperature -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM)(1) ±2000 V
Charged-device model (CDM) (2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted) (1)
MIN MAX UNIT
Buck Regulator VIN 4.3 60 V
VOUT 0.8 50
BOOT 66
SW -1 60
FB 0 5
Control EN 0 60 V
RT/SYNC 0 3.3
PGOOD to GND 0 5
Frequency Switching frequency range at RT mode 200 2500 kHz
Switching frequency range at SYNC mode 250 2300
Temperature Operating junction temperature, TJ -40 125 °C
(1) Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics .

6.4 Thermal Information

THERMAL METRIC (1) (2) LMR16010 UNIT
DDA (HSOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 42.5 °C/W
ψJT Junction-to-top characterization parameter 9.9 °C/W
ψJB Junction-to-board characterization parameter 25.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.8 °C/W
RθJB Junction-to-board thermal resistance 25.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Power rating at a specific ambient temperature TA should be determined with a maximum junction temperature (TJ) of 125 °C, which is illustrated in Recommended Operating Conditions section.

6.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ) range of -40 °C to +125 °C, unless otherwise stated. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25 °C, and are provided for reference purposes only. Unless otherwise specified, the following conditions apply: VIN = 4.3 V to 60 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY (VIN PIN)
VIN Operation input voltage 4.3 60 V
UVLO Under voltage lockout thresholds Rising threshold 3.8 4.0 4.2 V
Hysteresis 285 mV
ISHDN Shutdown supply current VEN = 0 V, TA = 25 °C, 4.3 V ≤ VIN ≤ 60 V 1.0 3.0 μA
IQ Operating quiescent current (non- switching) VFB = 1.0 V, TA = 25 °C 40 μA
ENABLE (EN PIN)
VEN_TH EN Threshold Voltage 1.05 1.20 1.38 V
IEN_PIN EN PIN current Enable threshold +50 mV -4.6 μA
Enable threshold -50 mV -1.0
IEN_HYS EN hysteresis current -3.6 μA
SOFT-START
tSS Internal soft-start time 10% to 90% of FB voltage 4.0 ms
POWER GOOD (PGOOD PIN)
VPG_UV Power-good flag under voltage tripping threshold POWER GOOD (% of FB voltage) 94 %
POWER BAD (% of FB voltage) 92 %
VPG_OV Power-good flag over voltage tripping threshold POWER BAD (% of FB voltage) 109 %
POWER GOOD (% of FB voltage) 107 %
VPG_HYS Power-good flag recovery hysteresis % of FB voltage 2 %
IPG PGOOD leakage current at high level output VPull-Up = 5 V 10 200 nA
VPG_LOW PGOOD low level output voltage IPull-Up = 1 mA 0.1 V
VIN_PG_MIN Minimum VIN for valid PGOOD output VPull-Up < 5 V at IPull-Up = 100 μA 1.6 1.95 V
VOLTAGE REFERENCE (FB PIN)
VFB Feedback voltage TJ = 25 °C 0.746 0.750 0.754 V
TJ = -40 °C to 125 °C 0.735 0.750 0.765 V
HIGH-SIDE MOSFET
RDS_ON On-resistance VIN = 12 V, BOOT to SW = 5.8 V 155 320 mΩ
HIGH-SIDE MOSFET CURRENT LIMIT
ILIMT Current limit VIN = 12 V, TA = 25 °C, Open Loop 1.45 1.75 2.1 A
THERMAL PERFORMANCE
TSHDN Thermal shutdown threshold 170 °C
THYS Hysteresis 12

6.6 Switching Characteristics

Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fSW Switching frequency RT = 11.5 kΩ 1758 1912 2066 kHz
Switching frequency range at SYNC mode 250 2300
VSYNC_HI SYNC clock high level threshold 1.7 V
VSYNC_LO SYNC clock low level threshold 0.5
TSYNC_MIN Minimum SYNC input pulse width Measured at 500 kHz, VSYNC_HI > 3 V, VSYNC_LO < 0.3 V 30 ns
TLOCK_IN PLL lock in time Measured at 500 kHz 100 µs
TON_MIN Minimum controllable on time VIN = 12 V, BOOT to SW = 5.8 V, ILoad = 1 A 90 ns
DMAX Maximum duty cycle fSW = 200 kHz 97%

6.7 Typical Characteristics

Unless otherwise specified the following conditions apply: VIN = 24 V, fSW = 500 KHz, L = 22 µH, COUT = 47 µF, TA = 25 °C.
LMR16010 D001_SNVSAH7.gif
VOUT = 3.3 V fSW = 500 KHz
Figure 1. Efficiency vs. Load Current
LMR16010 D003_SNVSAH7.gif
VOUT = 5 V fSW = 500 KHz
Figure 3. Efficiency vs. Load Current
LMR16010 D005_SNVSAH7.gif
VOUT = 5 V fSW = 500 KHz
Figure 5. Load Regulation
LMR16010 D006_SNVSAH7.gif
VOUT = 3.3 V fSW = 500 KHz
Figure 7. Dropout Curve
LMR16010 D010_SNVSAH9.gif
VIN = 12 V
Figure 9. Voltage Reference vs Junction Temperature
LMR16010 D008_SNVSAH9.gif
Figure 11. Shut-down Current and Quiescent Current
LMR16010 D002_SNVSAH7.gif
VOUT = 3.3 V fSW = 500 KHz
Figure 2. Efficiency vs. Load Current
LMR16010 D004_SNVSAH7.gif
VOUT = 5 V fSW = 500 KHz
Figure 4. Efficiency vs. Load Current
LMR16010 D005_SNVSA81.gif
Figure 6. Frequency vs VFB
LMR16010 D007_SNVSAH7.gif
VOUT = 5 V fSW = 500 KHz
Figure 8. Dropout Curve
LMR16010 D008_SNVSAH7.gif
Figure 10. High-Side Current Limit vs Junction Temperature
LMR16010 D009_SNVSAH9.gif
IOUT = 0 A
Figure 12. UVLO Threshold