ZHCSF36A December   2015  – May 2016 LMR16010

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency Peak Current Mode Control
      2. 7.3.2  Slope Compensation
      3. 7.3.3  Sleep-mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Adjustable Output Voltage
      6. 7.3.6  Enable and Adjustable Under-voltage Lockout
      7. 7.3.7  Switching Frequency and Synchronization (RT/SYNC)
      8. 7.3.8  Power Good (PGOOD)
      9. 7.3.9  Over Current and Short Circuit Protection
      10. 7.3.10 Overvoltage Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Set-Point
        2. 8.2.2.2 Switching Frequency
        3. 8.2.2.3 Output Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Schottky Diode Selection
        6. 8.2.2.6 Input Capacitor Selection
        7. 8.2.2.7 Bootstrap Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DDA Package
8-Pin (HSOIC)
Top View
LMR16010 pinout_snvsah8.gif

Pin Functions

PIN TYPE (1) DESCRIPTION
NAME NO.
BOOT 1 P Bootstrap capacitor connection for high-side MOSFET driver. Connect a high quality 0.1 μF capacitor from BOOT to SW.
VIN 2 P Connect to power supply and bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible.
EN 3 A Enable pin, with internal pull-up current source. Pull below 1.2 V to disable. Float or connect to VIN to enable. Adjust the input under voltage lockout with two resistors. See the Enable and Adjusting Under voltage lockout section.
RT/SYNC 4 A Resistor Timing or External Clock input. An internal amplifier holds this pin at a fixed voltage when using an external resistor to ground to set the switching frequency. If the pin is pulled above the PLL upper threshold, a mode change occurs and the pin becomes a synchronization input. The internal amplifier is disabled and the pin is a high impedance clock input to the internal PLL. If clocking edges stop, the internal amplifier is re-enabled and the operating mode returns to frequency programming by resistor.
FB 5 A Feedback input pin, connect to the feedback divider to set VOUT. Do not short this pin to ground during operation.
PGOOD 6 A Power-Good pin, open drain output for power-good flag, use a 10 kΩ to 100 kΩ pull-up resistor to logic rail or other DC voltage no higher than 7 V.
GND 7 G System ground pin.
SW 8 P Switching output of the regulator. Internally connected to high-side power MOSFET. Connect to power inductor.
Thermal Pad 9 G Major heat dissipation path of the die. Must be connected to ground plane on PCB.
(1) A = Analog, P = Power, G = Ground