ZHCSA20C October   2011  – June 2019 LMR10510

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
    1.     Pin Description: 5-Pin SOT-23
    2.     Pin Descriptions 6-Pin WSON
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Ratings
    3. 7.3 Electrical Characteristics
    4. 7.4 Typical Performance Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Soft Start
      2. 8.3.2 Output Overvoltage Protection
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Current Limit
      5. 8.3.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Custom Design With WEBENCH® Tools
        2. 9.2.1.2 Inductor Selection
        3. 9.2.1.3 Input Capacitor
        4. 9.2.1.4 Output Capacitor
        5. 9.2.1.5 Catch Diode
        6. 9.2.1.6 Output Voltage
        7. 9.2.1.7 Calculating Efficiency, and Junction Temperature
      2. 9.2.2 Application Curves
      3. 9.2.3 Other System Examples
        1. 9.2.3.1 LMR10510x Design Example 1
        2. 9.2.3.2 Lmr10510X Design Example 2
        3. 9.2.3.3 LMR10510Y Design Example 3
        4. 9.2.3.4 LMR10510Y Design Example 4
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Definitions
    4. 10.4 WSON Package
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Electrical Characteristics

VIN = 5 V unless otherwise indicated under the Conditions column. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback Voltage 0.588 0.600 0.612 V
ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3V to 5V 0.02 %/V
IB Feedback Input Bias Current 0.1 100 nA
UVLO Undervoltage Lockout VIN Rising 2.73 2.90 V
VIN Falling 1.85 2.3
UVLO Hysteresis 0.43 V
FSW Switching Frequency LMR10510-X 1.2 1.6 1.95 MHz
LMR10510-Y 2.25 3.0 3.75
DMAX Maximum Duty Cycle LMR10510-X 86 94 %
LMR10510-Y 82 90
DMIN Minimum Duty Cycle LMR10510-X 5 %
LMR10510-Y 7
RDS(ON) Switch On Resistance WSON Package 150 mΩ
SOT-23 Package 130 195
ICL Switch Current Limit VIN = 3.3V 1.2 1.75 A
VEN_TH Shutdown Threshold Voltage 0.4 V
Enable Threshold Voltage 1.8
ISW Switch Leakage 100 nA
IEN Enable Pin Current Sink/Source 100 nA
IQ Quiescent Current (switching) LMR10510X VFB = 0.55 3.3 5 mA
LMR10510Y VFB = 0.55 4.3 6.5 mA
Quiescent Current (shutdown) All Options VEN = 0V 30 nA
θJA Junction to Ambient
0 LFPM Air Flow(4) 		WSON Package 80 °C/W
SOT-23 Package 118
θJC Junction to Case WSON Package 18 °C/W
SOT-23 Package 80
TSD Thermal Shutdown Temperature 165 °C
(1) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
(2) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).
(3) Typical numbers are at 25°C and represent the most likely parametric norm.
(4) Applies for packages soldered directly onto a 3” × 3” PC board with 2-oz. copper on 4 layers in still air.