ZHCSKE0B
March 2017 – October 2019
LMH1208
PRODUCTION DATA.
1
特性
2
应用
3
说明
简化方框图
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Recommended SMBus Interface Timing Specifications
6.7
Serial Parallel Interface (SPI) Timing Specifications
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
4-Level Input Pins and Thresholds
7.3.2
OUT0_SEL and SDI_OUT2_SEL Control
7.3.3
Input Signal Detect
7.3.4
Continuous Time Linear Equalizer (CTLE)
7.3.5
Output Driver Control
7.3.5.1
Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
7.3.5.1.1
Output Amplitude (VOD)
7.3.5.1.2
Output Pre-Emphasis
7.3.5.1.3
Output Slew Rate
7.3.5.1.4
Output Polarity Inversion
7.3.5.2
Host-Side 100-Ω Output Driver (OUT0±)
7.3.6
Status Indicators and Interrupts
7.3.6.1
SD_N (Signal Detect)
7.3.6.2
INT_N (Interrupt)
7.4
Device Functional Modes
7.4.1
System Management Bus (SMBus) Mode
7.4.1.1
SMBus Read and Write Transaction
7.4.1.1.1
SMBus Write Operation Format
7.4.1.1.2
SMBus Read Operation Format
7.4.2
Serial Peripheral Interface (SPI) Mode
7.4.2.1
SPI Read and Write Transactions
7.4.2.2
SPI Write Transaction Format
7.4.2.3
SPI Read Transaction Format
7.4.2.4
SPI Daisy Chain
7.5
Register Maps
8
Application and Implementation
8.1
Application Information
8.1.1
SMPTE Requirements and Specifications
8.1.2
LMH1208 and LMH1228 Compatibility
8.2
Typical Applications
8.2.1
Dual Cable Driver
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.2.2
Distribution Amplifier
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Board Stack-Up and Ground References
10.1.2
High-Speed PCB Trace Routing and Coupling
10.1.3
Anti-Pads
10.1.4
BNC Connector Layout and Routing
10.1.5
Power Supply and Ground Connections
10.1.6
Footprint Recommendations
10.2
Layout Example
11
器件和文档支持
11.1
文档支持
11.1.1
相关文档
11.2
接收文档更新通知
11.3
社区资源
11.4
商标
11.5
静电放电警告
11.6
出口管制提示
11.7
Glossary
12
机械、封装和可订购信息
12.1
Package Option Addendum
12.1.1
Packaging Information
12.1.2
Tape and Reel Information
封装选项
机械数据 (封装 | 引脚)
RTV|32
MPQF166B
散热焊盘机械数据 (封装 | 引脚)
RTV|32
QFND101J
订购信息
zhcske0b_oa
7.3.5
Output Driver Control