SNOS879I August   1999  – May 2016 LM7301

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: 5-V DC
    6. 6.6 Electrical Characteristics: AC
    7. 6.7 Electrical Characteristics: 2.2-V DC
    8. 6.8 Electrical Characteristics: 30-V DC
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Capacitive Load Driving
      2. 7.2.2 Transient Response
      3. 7.2.3 Wide Supply Range
      4. 7.2.4 Specific Advantages of 5-Pin SOT-23 (TinyPak)
      5. 7.2.5 Low-Distortion, High-Output Drive Capability
    3. 7.3 Device Functional Modes
      1. 7.3.1 Stability Considerations
      2. 7.3.2 Power Dissipation
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Handheld Remote Controls
      2. 8.1.2 Remote Microphone in Personal Computers
      3. 8.1.3 Optical Line Isolation for Modems
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting RSENSE
        2. 8.2.2.2 Selecting R1, and R3 Values
        3. 8.2.2.3 R1, R2 Selection
        4. 8.2.2.4 Error Terms Expressions
        5. 8.2.2.5 Frequency Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resource
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (March 2013) to I Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed 58°C to 42°C in Power DissipationGo
  • Changed 113°C to 59°C in Power DissipationGo
  • Changed 29°C to 21°C in Power DissipationGo
  • Changed 57°C to 30°C in Power DissipationGo

Changes from G Revision (March 2013) to H Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo