SNVS769J March   2000  – December 2014 LM2940-N , LM2940C

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics (5 V and 8 V)
    6. 6.6 Electrical Characteristics (9 V and 10 V)
    7. 6.7 Electrical Characteristics (12 V and 15 V)
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Short-Circuit Current Limit
      2. 7.3.2 Overvoltage Shutdown (OVSD)
      3. 7.3.3 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with Enable Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Minimum Capacitance
          2. 8.2.2.1.2 ESR Limits
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Heatsinking
      1. 10.3.1 Heatsinking TO-220 Package Parts
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NDE|3
  • NGN|8
  • DCY|4
  • KTT|3
  • NEB|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from I Revision (April 2013) to J Revision

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted information re: obsolete CDIP and CLGA package options ; Change pin names from Vin, Vout to IN, OUT; delete Heatsinking sections re: packages apart from TO-220Go
  • Changed symbols for Thermal Information Go

Changes from H Revision (April 2013) to I Revision