4 修订历史记录
Changes from E Revision (February 2018) to F Revision
- Added footnote specifying that signals are only captured at positive edge of P1A_CLK Go
Changes from D Revision (August 2016) to E Revision
- Corrected LEDx_PWM and LEDx_EN descriptions in Pin Functions tableGo
- Added information about pullup resistor requirements on USB_DAT_P and other USB clarifying notes in Pin Functions tableGo
- Changed FAN_LOCKED pin to indicate it is unimplemented and FAM_PWM pin to indicate it is not user controllable in Pin Functions tableGo
- Corrected DMD interface setup and hold timings to be minimum values and updated the corresponding noteGo
- Updated "pulse-duration modulation" to "pulse width modulation" in Overview subsection of Detailed DescriptionGo
- Updated language concerning structured light applications related to the buffer, trigger modes, and video algorithms; also added additional requirements related to the maximum pattern speed in Structured Light ApplicationsGo
- Added Table 7, which lists summaries of trigger modes, and updated corresponding descriptionsGo
- Added DMD_TRC and DMD_LOADB to Routing Priority tableGo
- Deleted mention of spread-spectrum clock, which is not supportedGo
- Added MSL Peak Temp to Packaging InformationGo
Changes from C Revision (September 2013) to D Revision
- 将数据表的标题更改为“适用于 DLP4500 和 DLP4500NIR DMD 的 DLPC350 DLP 数字控制器”Go
- 在特性Go
- 将内部 RAM 空间更正为 64Mb 并删除了多余的“可存储多达 48 个 1 位图形”Go
- 将“外部并行闪存”上移至要点中;将 64MB 更改为 32MBGo
- Changed 将“视频投影模式”更改为“视频显示模式”Go
- Deleted 删除了“丰富的视频处理功能”Go
- 更改了说明中的 部分用词Go
- Changed “NIR”改为“近红外 (NIR)”Go
- Added 添加了 DLPR350 固件和 DLP4500 数据表的直接链接。Go
- Changed Description field of I2C_ADDR_SEL in Pin Function DescriptionsGo
- Changed I2C bus max to reference I2C0 and I2C1 Interface Timing Requirements in Pin Function Descriptions tableGo
- Updated note on ICTSEN and TRST in description column of Pin Function Descriptions tableGo
- Moved and changed "e.g. HDMI, BT656" in Pin Function Descriptions tableGo
- Removed Machine Model ESD information from ESD RatingsGo
- Changed Operating junction temperature to 105°C in Recommended Operating ConditionsGo
- Changed table notes for I2C0 and I2C1 Interface Timing RequirementsGo
- Added exception for 120 Hz source in Source Input BlankingGo
- Added VSYNC and HSYNC high value to Table 3Go
- Added Table 4Go
- Added Figure 7Go
- Added clarification on putting DLPC350 in tri-state during JTAG boundary scan in Board Level Test SupportGo
- Changed 48 bit-plane" to "48 1-bit planesGo
- Clarified wording about mapping options in (LVDS) Receiver Supported Pixel Mapping ModesGo
- Added Link to DLPR350 firmware pageGo
- Corrected flash access read and write timing to fixed valuesGo
- Removed subsection Application Performance Plot and figure Go
- Changed Figure 23 to reference DLPC350 and INIT_BUSY timing to 2.3 s max Go
- 相关文档Go
Changes from B Revision (September 2013) to C Revision
- 已更新至最新 TI 标准,并根据新数据表流程重新编排了内容Go
- Clarified the description for POWER_ON_OFF pin in the Pin Function DescriptionsGo
- Moved the pin descriptions as part of new data sheet flowGo
- Removed empty Conditions column from Absolute Maximum RatingsGo
- Separated the handling ratings from the absolute maximum ratingsGo
- Removed empty Conditions column from the Recommended Operating Conditions tableGo
- 添加了器件和文档支持 部分Go
Changes from A Revision (May 2013) to B Revision
- Added PIB_CLK and P1C_CLK to Pin Function DescriptionsGo
- Deleted PM_CS_0 from FLASH INTERFACE in Pin Function DescriptionsGo
- Deleted Y16 and AB17 from the RESERVED PINS list in Pin Function DescriptionsGo
- Added PM_CS_0 to the RESERVED PINS LIST in Pin Function DescriptionsGo
- Deleted "PM_CS_0 - available for optional Flash device ( ≤ 128 Mb)" From the Program Memory Flash Interface section Go
Changes from * Revision (April 2013) to A Revision