ZHCSIG4A July   2018  – June 2019 DLPC3434

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化应用
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions – Board Level Test, Debug, and Initialization
    2.     Pin Functions – Parallel Port Input Data and Control
    3.     Pin Functions – DMD Reset and Bias Control
    4.     Pin Functions – DMD Sub-LVDS Interface
    5.     Pin Functions – Peripheral Interface
    6.     Pin Functions – GPIO Peripheral Interface
    7.     Pin Functions – Clock and PLL Support
    8.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Characteristics
    8. 6.8  High-Speed Sub-LVDS Electrical Characteristics
    9. 6.9  Low-Speed SDR Electrical Characteristics
    10. 6.10 System Oscillators Timing Requirements
    11. 6.11 Power-Up and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
  7. Parameter Measurement Information
    1. 7.1 HOST_IRQ Usage Model
    2. 7.2 Input Frame Rates and 3-D Display Operation
      1. 7.2.1 Parallel Interface Data Transfer Format
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Interface Timing Requirements
        1. 8.3.1.1 Parallel Interface
      2. 8.3.2  Serial Flash Interface
      3. 8.3.3  Tested Flash Devices
      4. 8.3.4  Serial Flash Programming
      5. 8.3.5  SPI Signal Routing
      6. 8.3.6  I2C Interface Performance
      7. 8.3.7  Content-Adaptive Illumination Control
      8. 8.3.8  Local Area Brightness Boost
      9. 8.3.9  3-D Glasses Operation
      10. 8.3.10 DMD (Sub-LVDS) Interface
      11. 8.3.11 Calibration and Debug Support
      12. 8.3.12 DMD Interface Considerations
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC3434 Power-Up Initialization Sequence
    3. 10.3 DMD Fast PARK Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1  PCB Layout Guidelines for Internal ASIC PLL Power
      2. 11.1.2  DLPC3434 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3  General PCB Recommendations
      4. 11.1.4  General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5  Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6  Number of Layer Changes
      7. 11.1.7  Stubs
      8. 11.1.8  Terminations
      9. 11.1.9  Routing Vias
      10. 11.1.10 Thermal Considerations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
      2. 12.1.2 器件命名规则
        1. 12.1.2.1 器件标记
      3. 12.1.3 视频时序参数定义
    2. 12.2 相关链接
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
DLPC3434CZEZ ACTIVE NFBGA ZEZ 201 160 TBD Call TI Level-3-260C-168 HRS –30 to 85°C
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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