DLPS095 November   2017 DLP650LE

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Capacitance at Recommended Operating Conditions
    8. 6.8  Timing Requirements
    9. 6.9  Window Characteristics
    10. 6.10 System Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Device Nomenclature
      2. 10.1.2 Device Markings
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Features

  • 0.65-Inch Diagonal Micromirror Array
    • WXGA (1280 × 800) Array with >1 Million Micromirrors
    • 10.8 µm Micromirror Pitch
    • ±12° Micromirror Tilt Angle (Relative to Flat State)
    • Designed for Corner Illumination
  • 2 × LVDS Input Data Bus
  • Dedicated DLPC4422 Display Controller and DLPA100 Power Management Device and Motor Driver for Reliable Operation
  • DLPA200 Micromirror Driver

Applications

  • Smart Lighting
  • Business Projector
  • Education Projector

Description

The TI DLP650LE digital micromirror device (DMD) is a digitally controlled micro-electro-mechanical system (MEMS) spatial light modulator (SLM) that enables bright, affordable WXGA display solutions. The DLP650LE DMD, together with the DLPC4422 display controller, DLPA100 power and motor driver, and DLPA200 micromirror driver comprise the DLP® 0.65” WXGA chipset. This chipset is a great solution for display systems that require WXGA resolution, high brightness, and system simplicity.

Table 1. Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DLP650LE FYL (149) 35 mm × 32 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

DLP650LE dlp650le_systemdiagram_dlps095.gif