ZHCSIP9A July   2018  – September 2018 DLP230KP

PRODUCTION DATA.  

  1. 特性
  2. 显示 应用
  3. 说明
    1.     Device Images
      1.      简化应用
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions – Connector Pins
    2.     Pin Functions – Test Pads
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Micromirror Array Temperature Calculation

DLP230KP DS-23qHD-Therm.gifFigure 18. DMD Thermal Test Points

Micromirror array temperature cannot be measured directly, therefore it must be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load. The relationship between array temperature and the reference ceramic temperature (thermal test point TP1 in Figure 18) is provided by the following equations:

TARRAY = TCERAMIC + (QARRAY × RARRAY–TO–CERAMIC)

QARRAY = QELECTRICAL + QILLUMINATION

QILLUMINATION = (CL2W × SL)

where

where

  • TARRAY = Computed DMD array temperature (°C)
  • TCERAMIC = Measured ceramic temperature (°C), TP1 location in Figure 18
  • RARRAY–TO–CERAMIC = Thermal resistance from array to TP1 on ceramic (°C/W) specified in Thermal Information
  • QARRAY = Total (electrical + absorbed) DMD power on array (W)
  • QELECTRICAL = Nominal DMD electrical power dissipation (W)
  • CL2W = Conversion constant for screen lumens to absorbed optical power on the DMD (W/lm) specified below
  • SL = Measured ANSI screen lumens (lm)

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating frequencies. Nominal electrical power dissipation to use when calculating array temperature is 0.17 W. Absorbed optical power from the illumination source is variable and depends on the operating state of the micromirrors and the intensity of the light source. Equations shown above are valid for a 1-chip DMD system with total projection efficiency through the projection lens from DMD to the screen of 87%.

The conversion constant CL2W is based on the DMD micromirror array characteristics. It assumes a spectral efficiency of 300 lm/W for the projected light and illumination distribution of 83.7% on the DMD active array, and 16.3% on the DMD array border and window aperture. The conversion constant is calculated to be 0.00266 W/lm.

Sample calculations for typical projection application:

TCERAMIC = 55°C (measured)

SL = 200 lm (measured)

QELECTRICAL = 0.17 W

CL2W = 0.00266 W/lm

QARRAY = 0.17 W + (0.00266 W/lm × 200 lm) = 0.702 W

TARRAY = 55°C + (0.702 W × 9°C/W) = 61.32°C