SWAS037 February   2019 CC3135

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-2 Signal Descriptions
    4. 4.4 Connections for Unused Pins
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Current Consumption Summary: 2.4 GHz RF Band
    6. 5.6  Current Consumption Summary: 5 GHz RF Band
    7. 5.7  TX Power Control for 2.4 GHz Band
    8. 5.8  TX Power Control for 5 GHz
    9. 5.9  Brownout and Blackout Conditions
      1. Table 5-1 Brownout and Blackout Voltage Levels
    10. 5.10 Electrical Characteristics for DIO Pins
      1. Table 5-2 Electrical Characteristics: DIO Pins Except 52 and 53
      2. Table 5-3 Electrical Characteristics: DIO Pins 52 and 53
    11. 5.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 5.12 WLAN Receiver Characteristics
      1. Table 5-4 WLAN Receiver Characteristics: 2.4 GHz Band
      2. Table 5-5 WLAN Receiver Characteristics: 5 GHz Band
    13. 5.13 WLAN Transmitter Characteristics
      1. Table 5-6 WLAN Transmitter Characteristics: 2.4 GHz Band
      2. Table 5-7 WLAN Transmitter Characteristics: 5 GHz Band
    14. 5.14 WLAN Transmitter Out-of-Band Emissions
      1. Table 5-8 WLAN 2.4 GHz Filter Requirements
      2. Table 5-9 WLAN 5 GHz Filter Requirements
    15. 5.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 5.16 Thermal Resistance Characteristics for RGK Package
      1. 5.17 Timing and Switching Characteristics
        1. 5.17.1 Power Supply Sequencing
        2. 5.17.2 Device Reset
        3. 5.17.3 Reset Timing
          1. 5.17.3.1   nRESET (32-kHz Crystal)
          2. Table 5-11 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
          3. 5.17.3.2   nRESET (External 32-kHz Crystal)
            1. Table 5-12 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Crystal)
        4. 5.17.4 Wakeup From HIBERNATE Mode
          1. Table 5-13 nHIB Timing Requirements
        5. 5.17.5 Clock Specifications
          1. 5.17.5.1 Slow Clock Using Internal Oscillator
            1. Table 5-14 RTC Crystal Requirements
          2. 5.17.5.2 Slow Clock Using an External Clock
            1. Table 5-15 External RTC Digital Clock Requirements
          3. 5.17.5.3 Fast Clock (Fref) Using an External Crystal
            1. Table 5-16 WLAN Fast-Clock Crystal Requirements
          4. 5.17.5.4 Fast Clock (Fref) Using an External Oscillator
            1. Table 5-17 External Fref Clock Requirements (–40°C to +85°C)
        6. 5.17.6 Interfaces
          1. 5.17.6.1 Host SPI Interface Timing
            1. Table 5-18 Host SPI Interface Timing Parameters
          2. 5.17.6.2 Flash SPI Interface Timing
            1. Table 5-19 Flash SPI Interface Timing Parameters
          3. 5.17.6.3 DIO Interface Timing
            1. 5.17.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
              1. Table 5-20 DIO Output Transition Times (Vsupply = 3.3 V)
            2. 5.17.6.3.2 DIO Input Transition Time Parameters
              1. Table 5-21 DIO Input Transition Time Parameters
    17. 5.18 External Interfaces
      1. 5.18.1 SPI Flash Interface
      2. 5.18.2 SPI Host Interface
      3. 5.18.3 Host UART Interface
        1. 5.18.3.1 5-Wire UART Topology
        2. 5.18.3.2 4-Wire UART Topology
        3. 5.18.3.3 3-Wire UART Topology
  6. Detailed Description
    1. 6.1 Overview
    2. 6.2 Device Features
      1. 6.2.1 WLAN
      2. 6.2.2 Network Stack
      3. 6.2.3 Security
      4. 6.2.4 Host Interface and Driver
      5. 6.2.5 System
    3. 6.3 FIPS 140-2 Level 1 Certification
    4. 6.4 Power-Management Subsystem
      1. 6.4.1 VBAT Wide-Voltage Connection
    5. 6.5 Low-Power Operating Modes
      1. 6.5.1 Low-Power Deep Sleep
      2. 6.5.2 Hibernate
      3. 6.5.3 Shutdown
    6. 6.6 Memory
      1. 6.6.1 External Memory Requirements
    7. 6.7 Restoring Factory Default Configuration
    8. 6.8 Hostless Mode
  7. Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 BLE/2.4 GHz Radio Coexistence
      2. 7.1.2 Antenna Selection
      3. 7.1.3 Typical Application
    2. 7.2 PCB Layout Guidelines
      1. 7.2.1 General PCB Guidelines
      2. 7.2.2 Power Layout and Routing
        1. 7.2.2.1 Design Considerations
      3. 7.2.3 Clock Interface Guidelines
      4. 7.2.4 Digital Input and Output Guidelines
      5. 7.2.5 RF Interface Guidelines
  8. Device and Documentation Support
    1. 8.1  Third-Party Products Disclaimer
    2. 8.2  Tools and Software
    3. 8.3  Firmware Updates
    4. 8.4  Device Nomenclature
    5. 8.5  Documentation Support
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information
  10. 10Package Option Addendum
    1. 10.1 Packaging Information
    2. 10.2 Tape and Reel Information

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Device Overview