1. 模块概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 修订历史记录
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 CC3120MOD Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-1 Module Pin Attributes
    3. 4.3 Connections for Unused Pins
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Current Consumption Summary
    5. 5.5  TX Power and IBAT versus TX Power Level Settings
    6. 5.6  Brownout and Blackout Conditions
    7. 5.7  Electrical Characteristics
    8. 5.8  WLAN Receiver Characteristics
    9. 5.9  WLAN Transmitter Characteristics
    10. 5.10 Reset Requirement
    11. 5.11 Thermal Resistance Characteristics for MOB Package
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Power-Up Sequencing
      2. 5.12.2 Power-Down Sequencing
      3. 5.12.3 Device Reset
      4. 5.12.4 Wakeup From HIBERNATE Mode Timing
    13. 5.13 External Interfaces
      1. 5.13.1 SPI Host Interface
      2. 5.13.2 Host UART Interface
        1. 5.13.2.1 5-Wire UART Topology
        2. 5.13.2.2 4-Wire UART Topology
        3. 5.13.2.3 3-Wire UART Topology
      3. 5.13.3 External Flash Interface
  6. Detailed Description
    1. 6.1 Overview
    2. 6.2 Module Features
      1. 6.2.1 WLAN
      2. 6.2.2 Network Stack
        1. 6.2.2.1 Security
      3. 6.2.3 Host Interface and Driver
      4. 6.2.4 System
    3. 6.3 Power-Management Subsystem
      1. 6.3.1 VBAT Wide-Voltage Connection
    4. 6.4 Low-Power Operating Modes
      1. 6.4.1 Low-Power Deep Sleep
      2. 6.4.2 Hibernate
      3. 6.4.3 Shutdown
    5. 6.5 Restoring Factory Default Configuration
    6. 6.6 Device Certification and Qualification
      1. 6.6.1 FCC Certification and Statement
      2. 6.6.2 Industry Canada (IC) Certification and Statement
      3. 6.6.3 ETSI/CE Certification
      4. 6.6.4 Japan MIC Certification
      5. 6.6.5 SRRC Certification and Statement
    7. 6.7 Module Markings
    8. 6.8 End Product Labeling
    9. 6.9 Manual Information to the End User
  7. Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application
      2. 7.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 7.1.3 Reset
      4. 7.1.4 Unused Pins
    2. 7.2 PCB Layout Guidelines
      1. 7.2.1 General Layout Recommendations
      2. 7.2.2 RF Layout Recommendations
      3. 7.2.3 Antenna Placement and Routing
      4. 7.2.4 Transmission Line Considerations
  8. Environmental Requirements and Specifications
    1. 8.1 Temperature
      1. 8.1.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. 器件和文档支持
    1. 9.1 器件命名规则
    2. 9.2 开发工具和软件
    3. 9.3 固件更新
    4. 9.4 文档支持
    5. 9.5 Community Resources
    6. 9.6 商标
    7. 9.7 静电放电警告
    8. 9.8 Export Control Notice
    9. 9.9 Glossary
  10. 10机械、封装和可订购信息
    1. 10.1 机械、焊盘和焊锡膏制图
    2. 10.2 Package Option Addendum
      1. 10.2.1 Packaging Information
    3. 10.3 卷带封装信息
      1. 10.3.1 卷带封装规格

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOB|63
散热焊盘机械数据 (封装 | 引脚)