SWRS232A February   2019  – March 2019 CC2652RB

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RGZ Package (Top View)
    2. 4.2 Signal Descriptions – RGZ Package
    3. 4.3 Connections for Unused Pins and Modules
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Supply and Modules
    5. 5.5  Power Consumption - Power Modes
    6. 5.6  Power Consumption - Radio Modes
    7. 5.7  Nonvolatile (Flash) Memory Characteristics
    8. 5.8  Bluetooth Low Energy — Receive (RX)
    9. 5.9  Bluetooth Low Energy — Transmit (TX)
    10. 5.10 Zigbee and Thread — IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) — RX
    11. 5.11 Zigbee and Thread — IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) — TX
    12. 5.12 Thermal Resistance Characteristics
    13. 5.13 Timing and Switching Characteristics
      1. Table 5-1 Reset Timing
      2. Table 5-2 Wakeup Timing
      3. 5.13.1    Clock Specifications
        1. Table 5-3 48-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 48-MHz Bulk Acoustic Wave (BAW) Resonator
        3. Table 5-5 32.768-kHz Crystal Oscillator (XOSC_LF)
        4. Table 5-6 48-MHz RC Oscillator (RCOSC_HF)
        5. Table 5-7 2-MHz RC Oscillator (RCOSC_MF)
        6. Table 5-8 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.13.2    Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-9 Synchronous Serial Interface (SSI) Characteristics
      5. 5.13.3    UART
        1. Table 5-10 UART Characteristics
    14. 5.14 Peripheral Characteristics
      1. 5.14.1 ADC
        1. Table 5-11 ADC Characteristics
      2. 5.14.2 DAC
        1. Table 5-12 Digital-to-Analog Converter (DAC) Characteristics
      3. 5.14.3 Temperature and Battery Monitor
        1. Table 5-13 Temperature Sensor
        2. Table 5-14 Battery Monitor
      4. 5.14.4 Comparators
        1. Table 5-15 Continuous Time Comparator
        2. Table 5-16 Low-Power Clocked Comparator
      5. 5.14.5 Current Source
        1. Table 5-17 Programmable Current Source
      6. 5.14.6 GPIO
        1. Table 5-18 GPIO DC Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  System CPU
    3. 6.3  Radio (RF Core)
      1. 6.3.1 Bluetooth 5 low energy
      2. 6.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 6.4  Memory
    5. 6.5  Sensor Controller
    6. 6.6  Cryptography
    7. 6.7  Timers
    8. 6.8  Serial Peripherals and I/O
    9. 6.9  Battery and Temperature Monitor
    10. 6.10 µDMA
    11. 6.11 Debug
    12. 6.12 Power Management
    13. 6.13 Clock Systems
    14. 6.14 Network Processor
  7. 7Application, Implementation, and Layout
    1. 7.1 LaunchPad™ Development Kit Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 TI SimpleLink™
      2. 8.2.2 TI Design Network
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

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Device Overview