ZHCSCZ3A July   2014  – November 2015 CC2540T

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Electrical Characteristics
    5. 4.5  Thermal Resistance Characteristics for RHA Package
    6. 4.6  General Characteristics
    7. 4.7  RF Receive Section
    8. 4.8  RF Transmit Section
    9. 4.9  Current Consumption With TPS62730
    10. 4.10 32-MHz Crystal Oscillator
    11. 4.11 32.768-kHz Crystal Oscillator
    12. 4.12 32-kHz RC Oscillator
    13. 4.13 16-MHz RC Oscillator
    14. 4.14 RSSI Characteristics
    15. 4.15 Frequency Synthesizer Characteristics
    16. 4.16 Analog Temperature Sensor
    17. 4.17 Comparator Characteristics
    18. 4.18 ADC Characteristics
    19. 4.19 Control Input AC Characteristics
    20. 4.20 SPI AC Characteristics
    21. 4.21 Debug Interface AC Characteristics
    22. 4.22 Timer Inputs AC Characteristics
    23. 4.23 DC Characteristics
    24. 4.24 Typical Characteristics
    25. 4.25 Typical Current Savings
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Block Descriptions
      1. 5.3.1 CPU and Memory
      2. 5.3.2 Peripherals
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Input/Output Matching
    3. 6.3 Crystal
    4. 6.4 On-Chip 1.8-V Voltage Regulator Decoupling
    5. 6.5 Power-Supply Decoupling and Filtering
    6. 6.6 Reference Design
  7. 7器件和文档支持
    1. 7.1 文档支持
      1. 7.1.1 相关文档
      2. 7.1.2 社区资源
    2. 7.2 德州仪器 (TI) 低功耗射频网站
    3. 7.3 德州仪器 (TI) 低功耗射频开发者网络
    4. 7.4 低功耗射频电子新闻简报
    5. 7.5 商标
    6. 7.6 静电放电警告
    7. 7.7 出口管制提示
    8. 7.8 Glossary
  8. 8机械、封装和可订购信息
    1. 8.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 修订历史记录

Changes from July 2, 2015 to November 30, 2015

  • Changed 中的部分项特性Go
  • Changed from Handling Ratings table to ESD Ratings table Go
  • Added MIN value for output power in the RF Transmit Section table Go
  • Added Bluetooth Low Energy Light Reference Design to the document. Go